Methods for packaging image sensitive electronic devices
First Claim
1. A method for assembling a package containing an electronic device sensitive to light or other radiation comprising:
- mounting said electronic device on a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
providing at least one electrical interconnection between said electronic device and said first end of said at least one conductive trace;
forming a molded barrier on said carrier substrate, said molded barrier surrounding a central exposed area that contains said electronic device and said at least one electrical interconnection;
positioning a transparent lid over said central exposed area; and
fixing said transparent lid in place.
3 Assignments
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Accused Products
Abstract
The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections such as wire bonds and bond pads, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, chip encapsulation is accomplished with a unitary shell of entirely transparent material. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment. The transfer mold is then filled with molding compound to encapsulate the chip and interconnections, and to retain the transparent lid.
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Citations
41 Claims
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1. A method for assembling a package containing an electronic device sensitive to light or other radiation comprising:
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mounting said electronic device on a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
providing at least one electrical interconnection between said electronic device and said first end of said at least one conductive trace;
forming a molded barrier on said carrier substrate, said molded barrier surrounding a central exposed area that contains said electronic device and said at least one electrical interconnection;
positioning a transparent lid over said central exposed area; and
fixing said transparent lid in place. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. A method for assembling a package containing an electronic device sensitive to light or other radiation comprising:
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mounting said electronic device on a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
providing at least one electrical interconnection between a bond pad on said electronic device and said first end of said at least one conductive trace;
encapsulating said first end of said at least one conductive trace, said at least one electrical interconnection and said bond pad of said electronic device with a nonconductive material dispensed in liquid form;
covering a surface of said electronic device with a transparent lid;
curing the liquid nonconductive material to at least a semisolid state; and
retaining said transparent lid by an adhesive interface with said nonconductive material. - View Dependent Claims (15, 16, 17, 18, 19, 20, 21, 22)
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23. A method for assembling a package containing an electronic device sensitive to light or other radiation comprising:
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mounting said electronic device on a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
providing at least one electrical interconnection between a bond pad on said electronic device and said first end of said at least one conductive trace; and
enclosing said first end of said at least one conductive trace, said at least one electrical interconnection and said electronic device within a shell formed entirely of a transparent material. - View Dependent Claims (24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
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34. A method for assembling a package containing an electronic device sensitive to light or other radiation comprising:
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mounting said electronic device on a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
providing at least one electrical interconnection between said electronic device and said first end of said at least one conductive trace;
loading a transparent lid into a mold tooling element;
loading said carrier substrate with said electronic device and said at least one electrical interconnection into said mold tooling element so that a surface of said electronic device is aligned against said transparent lid;
filling said mold tooling element with molding compound;
forming a molded layer on said carrier substrate to encapsulate said at least one electrical interconnection and a perimeter of said electronic device; and
retaining said transparent lid with said molded layer. - View Dependent Claims (35, 36, 37, 38, 39, 40, 41)
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Specification