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Methods for packaging image sensitive electronic devices

  • US 20030232461A1
  • Filed: 02/21/2003
  • Published: 12/18/2003
  • Est. Priority Date: 06/04/2002
  • Status: Active Grant
First Claim
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1. A method for assembling a package containing an electronic device sensitive to light or other radiation comprising:

  • mounting said electronic device on a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;

    providing at least one electrical interconnection between said electronic device and said first end of said at least one conductive trace;

    forming a molded barrier on said carrier substrate, said molded barrier surrounding a central exposed area that contains said electronic device and said at least one electrical interconnection;

    positioning a transparent lid over said central exposed area; and

    fixing said transparent lid in place.

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