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Biocompatible bonding method and electronics package suitable for implantation

  • US 20030233134A1
  • Filed: 09/06/2002
  • Published: 12/18/2003
  • Est. Priority Date: 04/11/2002
  • Status: Active Grant
First Claim
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1. A device comprising:

  • a substrate at least a portion of which is electrically conductive;

    a flexible assembly; and

    at least one deposited rivet that bonds said substrate and said flexible assembly together.

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