Method and apparatus for supporting a substrate

• US 20030233750A1
• Filed: 03/21/2003
• Published: 12/25/2003
• Est. Priority Date: 06/19/2002
• Status: Active Grant

• Current Assignee: KPS Special Situations Fund II, L.P.
• Original Assignee: KPS Special Situations Fund II, L.P.
• Inventors: Morini, John E., Pham-Van-Diep, Gerald
• Granted Patent: US 7,028,391 B2
• Time in Patent Office: Days
• US Class Current: 29/840
• CPC Class Codes: H05K 13/0069 Holders for printed circuit boards
• CPC Class Codes: H05K 3/1216 by screen printing or stencil printing
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49144 by metal fusion
• CPC Class Codes: Y10T 29/5191 Assembly
• CPC Class Codes: Y10T 29/53174 Means to fasten electrical component to wiring board, base, or substrate
• CPC Class Codes: Y10T 29/53196 Means to apply magnetic force directly to position or hold work part
• CPC Class Codes: Y10T 29/532 Conductor
• CPC Class Codes: Y10T 29/53983 Work-supported apparatus

Abstract

An apparatus for performing operations on at least one surface of an electronic substrate having a first surface and a second surface includes a frame, a transportation system that moves the substrate through the apparatus, a substrate support system, coupled to the frame, having a non-rigid portion that contacts and supports the substrate during an operation on the substrate, wherein the non-rigid portion allows flexure of the substrate before and during the performance of an operation on the substrate, and a device coupled to the frame that performs an operation on a surface of the substrate.

Claims

1. An apparatus for performing operations on at least one surface of an electronic substrate having a first surface and a second surface, the apparatus comprising:

a frame;

a transportation system that moves the substrate through the apparatus;

a substrate support system, coupled to the frame, having a non-rigid portion that contacts and supports the substrate during an operation on the substrate, wherein the non-rigid portion allows flexure of the substrate before and during the performance of an operation on the substrate; and

a device coupled to the frame that performs an operation on a surface of the substrate.

2. The apparatus of claim 1 wherein the support system is moveable from a lowered position to a raised position, wherein in the raised position the non-rigid portion contacts a side of the electronic substrate.

3. The apparatus of claim 2 wherein the non-rigid portion is foam.

4. The apparatus of claim 2 wherein the non-rigid portion is a sponge.

5. The apparatus of claim 1, wherein the device is a stencil and the substrate is a circuit board.

6. The apparatus of claim 5, wherein the non-rigid portion contacts the underside of the circuit board and conforms to the topography of the circuit board.

7. A method of performing an operation on an electronic substrate, the method comprising:

loading the substrate into a processing machine;

moving a support system to a position below the electronic substrate;

contacting a side of the substrate with a non-rigid member of the support system, wherein the non-rigid member yields when contacted by the substrate;

performing a manufacturing operation on the substrate; and

removing the substrate from the processing machine.

8. The method of claim 7 further comprising printing solder paste on the electronic substrate, wherein a stencil and a squeegee are used to accomplish printing.

9. The method of claim 8 further comprising returning the support system to a home position after the substrate is removed from the processing machine.

10. The method of claim 9 wherein contacting further comprises holding the substrate in a substantially non-planar orientation for the duration of contact by the support system.

11. The method of claim 10 further comprising allowing the substrate to flex in reaction to a force applied to the substrate during performing an operation on the substrate.

12. The method of claim 11 further comprising resting the electronic substrate on foam while performing the manufacturing operation.

13. An apparatus for supporting an electronic substrate during a manufacturing operation, the apparatus comprising:

a frame;

supporting means, coupled to the frame, for non-rigidly supporting electronic substrates, wherein the means for non-rigidly supporting allow flexure of the electronic substrate before and during the manufacturing operation.

14. The apparatus of claim 13 further comprising means for moving the supporting means from a position in contact with the electronic substrate to a position removed from the electronic substrate.

15. The apparatus of claim 14, further comprising a stencil to print solder paste on the substrate.

16. The apparatus of claim 15, further comprising a squeegee for depositing solder paste onto the substrate.

17. The apparatus of claim 16, wherein the means for non-rigidly supporting is foam.

18. The apparatus of claim 17, wherein the means for non-rigidly supporting is a sponge.