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Integrated circuit package and method of manufacturing the integrated circuit package

  • US 20030234454A1
  • Filed: 06/24/2002
  • Published: 12/25/2003
  • Est. Priority Date: 06/24/2002
  • Status: Active Grant
First Claim
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1. An integrated circuit package, comprising:

  • a lead frame comprising a lead comprising an inner pad and an outer pad connected by a connection member, wherein a region of said inner pad and a region of said outer pad are separated by a channel extending through a width of said lead;

    a semiconductor die electrically coupled with said inner pad of said lead; and

    an encapsulant material encapsulating at least a portion of said lead frame, wherein a portion of said outer pad is exposed.

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