Capacitive sensing device

• US 20030234770A1
• Filed: 04/03/2003
• Published: 12/25/2003
• Est. Priority Date: 06/25/2002
• Status: Active Grant

• Current Assignee: Synaptics Incorporated
• Original Assignee: Synaptics Incorporated
• Inventors: MacKey, Bob Lee
• Granted Patent: US 7,463,246 B2
• Time in Patent Office: Days
• US Class Current: 345/173
• CPC Class Codes: G06F 3/0445 using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
• CPC Class Codes: G06F 3/0446 using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes

Abstract

One embodiment in accordance with the present invention includes a capacitive sensing device. The capacitive sensing device comprises a substantially transparent substrate and a set of patterned conductive traces formed above the substantially transparent substrate. Each of the set of patterned conductive traces has a width such that the capacitive sensing device does not have to be arranged with respect to an underlying image in order to avoid deleterious obstruction of the underlying image by the set of patterned conductive traces. The underlying image is separate from the capacitive sensing device. The capacitive sensing device is separate from active components used to comprise an information display device.

Claims

1. A capacitive sensing device comprising:

a substantially transparent substrate; and

a first set of patterned conductive traces formed above said substantially transparent substrate, each of said first set of patterned conductive traces having a width such that said capacitive sensing device does not have to be arranged with respect to an underlying image in order to avoid deleterious obstruction of said underlying image by said first set of patterned conductive traces, said underlying image is separate from said capacitive sensing device, wherein said capacitive sensing device is separate from active components used to comprise an information display device.

2. The capacitive sensing device as described in claim 1, further comprising:

a second set of patterned conductive traces formed and coupled to said substantially transparent substrate.

3. The capacitive sensing device as described in claim 2, wherein each of said second set of patterned conductive traces has a width such that said capacitive sensing device does not have to be arranged with respect to an underlying image in order to avoid deleterious obstruction of said underlying image by said second set of patterned conductive traces.

4. The capacitive sensing device as described in claim 2, further comprising:

an insulating material coupled between said first set of patterned conductive traces and said second set of patterned conductive traces.

5. The capacitive sensing device as described in claim 4, wherein said insulating material is substantially transparent.

6. The capacitive sensing device as described in claim 1, wherein each of said first set of patterned conductive traces has a width less than approximately 12 micrometers.

7. The capacitive sensing device as described in claim 1, wherein each of said first set of patterned conductive traces has a width such that each of said first set of patterned conductive traces is not required to be formed of a substantially transparent material.

8. The capacitive sensing device as described in claim 1, wherein each of said first set of patterned conductive traces has a width less than a width of a pixel of said underlying image.

9. The capacitive sensing device as described in claim 1, wherein each of said first set of patterned conductive traces is a capacitive sensing element.

10. The capacitive sensing device as described in claim 1, wherein said substantially transparent substrate is a component of said information display device.

11. The capacitive sensing device as described in claim 1, wherein said substantially transparent substrate is selected from a group consisting of:

a glass, a plastic, and a crystalline material.

12. The capacitive sensing device as described in claim 1, wherein said first set of patterned conductive traces is formed of at least one layer of material that is substantially opaque.

13. The capacitive sensing device as described in claim 1, wherein said first set of patterned conductive traces is formed of at least one layer of material that is substantially non-reflective.

14. The capacitive sensing device as described in claim 1, further comprising:

a landing pad region formed above said substantially transparent substrate for coupling a sensing circuit component to said substantially transparent substrate.

15. A method for fabricating a capacitive sensing device, said method comprising:

utilizing a substantially transparent substrate; and

patterning a first set of conductive traces above said substantially transparent substrate, each of said first set of conductive traces having a width such that said capacitive sensing device does not have to be arranged with respect to an underlying image in order to avoid deleterious obstruction of said underlying image by said first set of conductive traces, said underlying image is separate from said capacitive sensing device, wherein said capacitive sensing device is fabricated separately from active components of an information display.

16. The method as described in claim 15, wherein said patterning said first set of conductive traces comprises a process selected from the group consisting of:

a lithographic process, a printing process, electron beam lithography, screen printing, inkjet printing, offset printing, electroplating, stamping, and LIGA.

17. The method as described in claim 15, further comprising:

patterning a second set of conductive traces above and coupled to said substantially transparent substrate.

18. The method as described in claim 17, wherein each of said second set of conductive traces has a width such that said capacitive sensing device does not have to be arranged with respect to said underlying image in order to avoid deleterious obstruction of said underlying image by said second set of conductive traces.

19. The method as described in claim 17, wherein said patterning said second set of conductive traces comprises a process selected from the group consisting of:

a lithographic process, a printing process, electron beam lithography, screen printing, inkjet printing, offset printing, electroplating, stamping, and LIGA.

20. The method as described in claim 17, wherein said first set of conductive traces and said second set of conductive traces are substantially orthogonal to each other.

21. The method as described in claim 17, wherein said first set of conductive traces or said second set of conductive traces comprises at least one layer of substantially opaque material.

22. The method as described in claim 17, further comprising:

depositing an insulating material above at least a portion of said first set of conductive traces.

23. The method as described in claim 17, wherein said insulating material is substantially transparent.

24. The method as described in claim 17, wherein said first set of conductive traces or said second set of conductive traces is formed of at least one layer of material that is substantially non-reflective.

25. The method as described in claim 17, wherein said patterning said second set of conductive traces comprises:

patterning a landing pad region above said substantially transparent substrate for coupling a sensing circuit component to said substantially transparent substrate.

26. The method as described in claim 15, wherein said substantially transparent substrate is a component of said information display device.

27. The method as described in claim 15, wherein said substantially transparent substrate is selected from a group consisting of:

a glass, a plastic, and a crystalline material.

28. The method as described in claim 15, wherein said first set of conductive traces is formed of at least one layer of material that is substantially opaque.

29. The method as described in claim 15, wherein said patterning said first set of conductive traces comprises:

patterning a landing pad region above said substantially transparent substrate for coupling a sensing circuit component to said substantially transparent substrate.

30. The method as described in claim 15, wherein each of said first set of conductive traces has a width less than approximately 12 micrometers.

31. The method as described in claim 15, wherein each of said first set of conductive traces has a width such that each of said first set of conductive traces is not required to be formed of a substantially transparent material.

32. The method as described in claim 15, wherein each of said first set of conductive traces has a width less than a pixel width of said underlying image.

33. The method as described in claim 15, wherein each of said first set of conductive traces is a capacitive sensing element.

34. A capacitive sensing device formed by a process comprising:

utilizing a substantially transparent substrate; and

using a first patterning process to generate a first plurality of conductive traces above said substantially transparent substrate, said first patterning process generating each of said first plurality of conductive traces having a width such that said capacitive sensing device does not have to be arranged with respect to an underlying image in order to avoid deleterious obstruction of said underlying image by said first plurality of conductive traces, said underlying image is separate from said capacitive sensing device, wherein said capacitive sensing device is formed separately from active components of an information display.

35. The capacitive sensing device as described in claim 34, wherein said first patterning process is selected from the group consisting of:

a lithographic process, a printing process, electron beam lithography, screen printing, inkjet printing, offset printing, electroplating, stamping, and LIGA.

36. The capacitive sensing device as described in claim 34, further comprising:

using a second patterning process to generate a second plurality of conductive traces above and coupled to said substantially transparent substrate.

37. The capacitive sensing device as described in claim 36, wherein said second patterning process generates each of said second plurality of conductive traces has a width such that said capacitive sensing device does not have to be arranged with respect to said underlying image in order to avoid deleterious obstruction of said underlying image by said second plurality of conductive traces.

38. The capacitive sensing device as described in claim 36, wherein said first patterning process and said second patterning process are each selected from the group consisting of:

a lithographic process, a printing process, electron beam lithography, screen printing, inkjet printing, offset printing, electroplating, stamping, and LIGA.

39. The capacitive sensing device as described in claim 36, wherein said first plurality of conductive traces and said second plurality of conductive traces are substantially orthogonal to each other.

40. The capacitive sensing device as described in claim 36, wherein said first plurality of conductive traces or said second plurality of conductive traces comprises at least one layer of substantially opaque material.

41. The capacitive sensing device as described in claim 34, further comprising:

depositing an insulating material above at least a portion of said first plurality of conductive traces.

42. The capacitive sensing device as described in claim 41, wherein said insulating material is substantially transparent.

43. The capacitive sensing device as described in claim 34, wherein said substantially transparent substrate is a component of said information display device.

44. The capacitive sensing device as described in claim 34, wherein said substantially transparent substrate is selected from a group consisting of:

a glass, a plastic, and a crystalline material.

45. The capacitive sensing device as described in claim 34, wherein said first plurality of conductive traces is formed of at least one layer of material that is substantially opaque.

46. The capacitive sensing device as described in claim 34, wherein said first plurality of conductive traces is formed of at least one layer of material that is substantially non-reflective.

47. The capacitive sensing device as described in claim 34, further comprising:

generating a landing pad region above said substantially transparent substrate for coupling a sensing circuit component to said substantially transparent substrate.

48. The capacitive sensing device as described in claim 47, wherein said generating said landing pad region is performed during said first patterning process or said second patterning process.

49. The capacitive sensing device as described in claim 34, wherein each of said first plurality of conductive traces has a width less than approximately 12 micrometers.

50. The capacitive sensing device as described in claim 34, wherein each of said first plurality of conductive traces has a width such that each of said first plurality of conductive traces is not required to be formed of a substantially transparent material.

51. The capacitive sensing device as described in claim 34, wherein each of said first plurality of conductive traces has a width less than a pixel width of said underlying image.

52. The capacitive sensing device as described in claim 34, wherein each of said first plurality of conductive traces is a capacitive sensing element.