Planar optical waveguide assembly and method of preparing same
First Claim
1. A method of preparing a planar optical waveguide assembly, comprising the steps of:
- (i) applying a curable polymer composition to a surface of a substrate to form a polymer film;
(ii) curing the polymer film to form a lower clad layer;
(iii) applying a silicone composition to the lower clad layer to form a silicone film, wherein the silicone composition comprises;
(A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition, and (C) a catalytic amount of a photoactivated hydrosilylation catalyst;
(iv) exposing at least one selected region of the silicone film to radiation having a wavelength of from 150 to 800 nm to produce a partially exposed film having at least one exposed region and at least one non-exposed region;
(v) removing the non-exposed region of the partially exposed film with a developing solvent to form a patterned film; and
(vi) heating the patterned film for an amount of time sufficient to form at least one silicone core having a refractive index of from 1.3 to 1.7 at 23°
C. for light having a wavelength of 589 nm;
wherein the lower clad layer has a refractive index less than the refractive index of the silicone core.
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Abstract
A method of preparing a planar optical waveguide assembly, comprising the steps of (i) applying a curable polymer composition to a surface of a substrate to form a polymer film; (ii) curing the polymer film to form a lower clad layer; (iii) applying a silicone composition to the lower clad layer to form a silicone film; (iv) exposing at least one selected region of the silicone film to radiation having a wavelength of from 150 to 800 nm to produce a partially exposed film having at least one exposed region and at least one non-exposed region; (v) removing the non-exposed region of the partially exposed film with a developing solvent to form a patterned film; and (vi) heating the patterned film for an amount of time sufficient to form at least one silicone core having a refractive index of from 1.3 to 1.7 at 23° C. for light having a wavelength of 589 nm; wherein the lower clad layer has a refractive index less than the refractive index of the silicone core. A planar optical waveguide assembly prepared according to the method of the invention.
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Citations
37 Claims
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1. A method of preparing a planar optical waveguide assembly, comprising the steps of:
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(i) applying a curable polymer composition to a surface of a substrate to form a polymer film;
(ii) curing the polymer film to form a lower clad layer;
(iii) applying a silicone composition to the lower clad layer to form a silicone film, wherein the silicone composition comprises;
(A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition, and (C) a catalytic amount of a photoactivated hydrosilylation catalyst;
(iv) exposing at least one selected region of the silicone film to radiation having a wavelength of from 150 to 800 nm to produce a partially exposed film having at least one exposed region and at least one non-exposed region;
(v) removing the non-exposed region of the partially exposed film with a developing solvent to form a patterned film; and
(vi) heating the patterned film for an amount of time sufficient to form at least one silicone core having a refractive index of from 1.3 to 1.7 at 23°
C. for light having a wavelength of 589 nm;
wherein the lower clad layer has a refractive index less than the refractive index of the silicone core. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method of preparing a planar optical waveguide assembly, comprising the steps of:
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(i) applying a curable polymer composition to a surface of a substrate to form a polymer film;
(ii) curing the polymer film to form a lower clad layer;
(iii) applying a silicone composition to the lower clad layer to form a silicone film, wherein the silicone composition comprises;
(A) an organopolysiloxane containing an average of at least two silicon-bonded alkenyl groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule in a concentration sufficient to cure the composition, and (C) a catalytic amount of a photoactivated hydrosilylation catalyst;
(iv) exposing at least one selected region of the silicone film to radiation having a wavelength of from 150 to 800 nm to produce a partially exposed film having at least one exposed region and at least one non-exposed region;
(v) heating the partially exposed film for an amount of time such that the exposed region is substantially insoluble in a developing solvent and the non-exposed region is soluble in the developing solvent;
(vi) removing the non-exposed region of the heated film with the developing solvent to form a patterned film; and
(vii) heating the patterned film for an amount of time sufficient to form at least one silicone core having a refractive index of from 1.3 to 1.7 at 23°
C. for light having a wavelength of 589 nm;
wherein the lower clad layer has a refractive index less than the refractive index of the silicone core. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37)
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Specification