Signal sharing circuit with microelectronic die isolation features
First Claim
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1. A signal sharing circuit, comprising:
- a first pad adapted to receive a signal; and
a first sharing device associated with a first microelectronic die and adapted to selectively share the signal with at least a second microelectronic die on one side of the first microelectronic die in response to a first share control signal.
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Abstract
A signal sharing circuit includes a first pad adapted to receive a signal and a first sharing device associated with a first microelectronic die. The first sharing device is adapted to selectively share the signal with at least a second microelectronic die on one side of the first microelectronic die in response to a first share control signal.
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Citations
88 Claims
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1. A signal sharing circuit, comprising:
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a first pad adapted to receive a signal; and
a first sharing device associated with a first microelectronic die and adapted to selectively share the signal with at least a second microelectronic die on one side of the first microelectronic die in response to a first share control signal. - View Dependent Claims (2, 3, 4, 5)
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6. A signal sharing circuit comprising:
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a pad adapted to receive one of a signal, power or ground potential; and
a plurality of sharing devices, at least one sharing device associated with each one of a plurality of microelectronic dies to selectively share the signal, power or ground potential with other dies of the plurality of microelectronic dies.
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7. A signal sharing circuit, comprising:
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a first pad adapted to receive a signal;
a part pad coupled to a first microelectronic die; and
an isolation device adapted to transfer the signal from the first pad to the part pad in response to an isolation control signal. - View Dependent Claims (8, 9, 10)
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11. A signal sharing circuit, comprising:
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a first pad adapted to receive a signal;
a part pad coupled to a first microelectronic die;
an isolation device adapted to transfer the signal from the first pad to the part pad in response to an isolation control signal; and
an isolation control circuit to provide the isolation control signal. - View Dependent Claims (12, 13, 14, 15, 16)
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17. A programmable signal sharing circuit, comprising:
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a first pad adapted to receive a signal;
a part pad coupled to a first microelectronic die;
a isolation circuit adapted to transfer the signal from the first pad to the part pad in response to an isolation control signal;
a first sharing device adapted to couple the signal to a second microelectronic die on one side of the first microelectronic die in response to a first share control signal; and
a second sharing device adapted to couple the signal to a third microelectronic die on another side of the first microelectronic die in response to a second share control signal. - View Dependent Claims (18, 19, 20, 21)
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22. A signal sharing circuit, comprising:
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a first pad adapted to receive a signal;
a part pad coupled to a first microelectronic die;
a isolation circuit adapted to transfer the signal from the first pad to the part pad in response to an isolation control signal;
a first sharing device adapted to couple the signal to a second microelectronic die on one side of the first microelectronic die in response to a first share control signal;
a second sharing device adapted to couple the signal to a third microelectronic die on another side of the first microelectronic die in response to a second share control signal;
a first share control circuit to provide the first share control signal;
a second share control circuit to provide the second share control signal; and
an isolation control circuit to provide the isolation control signal. - View Dependent Claims (23, 24, 25, 26)
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27. A signal sharing circuit, comprising:
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at least one pad adapted to receive a signal; and
a plurality of sharing devices, wherein at least one sharing device is associated with each one of a plurality of microelectronic dies to share the signal with an adjacent die in response to the at least one sharing device receiving a share control signal. - View Dependent Claims (28, 29, 30)
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31. A microelectronic die, comprising:
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a first pad adapted to receive a signal; and
a sharing device adapted to share the signal with at least a second microelectronic die in response to a share control signal. - View Dependent Claims (32, 33, 34)
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35. A microelectronic die, comprising:
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a multiplicity of probe pads each adapted to receive an associated test signal; and
a plurality of first sharing devices each coupled to a selected one of the multiplicity of probe pads to selectively share the associated test signal with at least a second microelectronic die in one direction relative to the microelectronic die in response to each first sharing device receiving an associated share control signal. - View Dependent Claims (36, 37)
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38. A semiconductor wafer, comprising:
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a plurality of microelectronic dies;
a first pad adapted to receive a signal; and
at least one sharing device associated with each of the plurality of microelectronic dies adapted to share the signal in one direction from each of the plurality of microelectronic dies in response to a share control signal. - View Dependent Claims (39, 40, 41, 42)
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43. A semiconductor wafer, comprising:
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a plurality of microelectronic dies divided into groups of a chosen number of dies;
a set of test pads associated with each group of microelectronic dies, each test pad being adapted to receive a predetermined signal; and
at least one sharing device associated with each of selected ones of the plurality of test pads and associated with each microelectronic die to selectively share the predetermined signal with other microelectronic dies in response to a first share control signal. - View Dependent Claims (44, 45, 46, 47, 48, 49, 50, 51)
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52. An electronic system, comprising:
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a processor; and
a memory system coupled to the processor, wherein at least one of the processor and the memory system are formed on a microelectronic die, the microelectronic die including at least one sharing device to share a signal in one direction from the microelectronic die. - View Dependent Claims (53, 54)
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55. An electronic system, comprising:
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a processor; and
a memory system coupled to the processor, wherein at least one of the processor and the memory system are formed on a microelectronic die including a sharing circuit, the sharing circuit including;
a first pad to receive a test signal during testing of the system;
at least one share device to share the test signal in one direction from the microelectronic die; and
a second device to selectively prevent the first pad from being coupled to the microelectronic die during normal operations of the electronic system. - View Dependent Claims (56, 57)
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58. A module, comprising:
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a plurality of microelectronic dies; and
at least one signal sharing circuit interconnecting each of the plurality of microelectronic dies. - View Dependent Claims (59, 60, 61)
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62. A method of making a signal sharing circuit, comprising:
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forming a first pad adapted to receive a signal; and
forming a first share device associated with a first microelectronic die adapted to share the signal with at least a second microelectronic die on one side of the first microelectronic die. - View Dependent Claims (63, 64)
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65. A method of making a signal sharing circuit, comprising:
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forming a first pad adapted to receive a control signal;
forming a first share device associated with a first microelectronic die adapted to share the signal with at least a second microelectronic die on one side of the first microelectronic die in response to a first share control signal; and
forming a first share control circuit to provide a first share control signal. - View Dependent Claims (66)
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67. A method of making a microelectronic die, comprising:
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forming a first pad adapted to receive a signal; and
forming a sharing device adapted to share the signal with at least a second microelectronic die. - View Dependent Claims (68, 69)
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70. A method of making a microelectronic die, comprising:
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forming a multiplicity of probe pads each adapted to receive an associated signal; and
forming a plurality of first sharing devices each coupled to a selected one of the multiplicity of probe pads to selectively share the associated signal with at least a second microelectronic die in one direction from the microelectronic die in response to receiving an associated share control signal. - View Dependent Claims (71)
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72. A method of making a semiconductor wafer, comprising:
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forming a plurality of microelectronic dies;
forming a first pad adapted to receive a signal; and
forming at least one sharing device associated with each of the plurality of microelectronic dies adapted to share the signal in one direction from each of the plurality of microelectronic dies in response to a share control signal. - View Dependent Claims (73)
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74. A method of making an electronic system, comprising:
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forming a processor; and
forming a memory system coupled to the processor, wherein at least one of the processor and the memory system are formed on a microelectronic die including an signal sharing circuit and wherein forming the signal sharing circuit includes forming at least a first share device associated with the microelectronic die adapted to share a signal in one direction relative to the microelectronic die. - View Dependent Claims (75)
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76. A method of making an electronic system, comprising:
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forming a processor; and
forming a memory system coupled to the processor, wherein at least one of the processor and the memory system are formed on a microelectronic die wherein forming the electronic die includes;
forming a multiplicity of probe pads each adapted to receive an associated test signal; and
forming a plurality of first sharing devices each coupled to a selected one of the multiplicity of probe pads, wherein each first sharing device selectively shares the associated test signal in one direction relative to the microelectronic die in response to receiving an associated share control signal. - View Dependent Claims (77)
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78. A method of sharing a test signal across a semiconductor wafer, comprising:
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applying the test signal to a test pad; and
operating a share device to share the test signal in one direction relative to a microelectronic die. - View Dependent Claims (79, 80, 81, 82)
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83. A method of sharing a test signal across a semiconductor wafer, comprising:
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applying the test signal to a test pad; and
selectively sharing the test signal in at least one direction with a plurality of microelectronic dies. - View Dependent Claims (84, 85)
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86. A method of making a module, comprising:
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forming a plurality of microelectronic dies; and
forming at least one signal sharing circuit interconnecting each of the plurality of microelectronic dies. - View Dependent Claims (87, 88)
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Specification