Integrated passive devices fabricated utilizing multi-layer, organic laminates

• US 20040000968A1
• Filed: 03/28/2003
• Published: 01/01/2004
• Est. Priority Date: 06/26/2002
• Status: Active Grant

• Current Assignee: Georgia Tech Research Corporation (University System of Georgia)
• Original Assignee: Georgia Tech Research Corporation (University System of Georgia)
• Inventors: Sundaram, Venkatesh, Swaminathan, Madhavan, Dalmia, Sidharth, White, George E.
• Granted Patent: US 6,900,708 B2
• Time in Patent Office: Days
• US Class Current: 333/185
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01F 41/041 Printed circuit coils apparatus or processes for manufacturing printed circuits in general H05K3/00
• CPC Class Codes: H01L 21/4857 Multilayer substrates multilayer metallisation on monolayer substrate H01L21/4846
• CPC Class Codes: H01L 25/0652 the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01P 1/20381 Special shape resonators
• CPC Class Codes: H03H 7/38 Impedance-matching networks

Abstract

The present invention includes an organic device that can be integrated in a multilayer board made of organic material. The passive devices can be integrally fabricated on a circuit board in either surface mount device (SMD) or ball grid array (BGA) form. Alternatively, the passive device can be constructed in a stand alone SMD or BGA/chip scale package (CSP) form to make it mountable on a multilayer board, ceramic carrier or silicon platform in the form of an integrated passive device. The passive device includes side shielding on two sides in the SMD form and four sides in the BGA/CSP form. The side shielding can be external or in-built.

Claims

1. An organic bandpass filter, comprising:

a first core layer having an upper surface and a lower surface;

a second core layer having an upper surface and a lower surface, wherein the first core layer and the second core layer are positioned opposite one another so that the lower surface of the first core layer is facing the upper surface of the second core layer;

an organic dielectric layer having at least two resonators, wherein two of the resonators are coupled to each other, the organic dielectric layer being arranged between the first core layer and the second core layer;

a first shield electrode on the upper surface of the first core layer opposite the organic dielectric layer;

a second shield electrode on the lower surface of the second core layer opposite the organic dielectric layer; and

a side shield electrode in electrical contact with the first and second shield electrodes.

2. The bandpass filter of claim 1, wherein the resonators are coupled magnetically, electrically or a combination thereof.

3. The bandpass filter of claim 1, wherein the resonators comprise a combination of transmission lines, inductors and capacitors.

4. The bandpass filter of claim 1, wherein the resonators are formed by transmission line.

5. The bandpass filter of claim 1, wherein the resonators are formed by inductors.

6. The bandpass filter of claim 1, wherein each of the resonators comprises an inductor connected to a parallel plate capacitor, wherein the capacitors include disconnected plates sandwiching the organic dielectric layer.

7. The bandpass filter of claim 1, further comprising an external input terminal electrode and an external output terminal electrode formed on opposite side surfaces of the filter, and the side shield electrode being disposed on other opposite sides of the filter.

8. The bandpass filter of claim 7, wherein the organic dielectric layer includes a circuit matching device connected to the external input terminal electrode and a second circuit matching device connected to the external output terminal electrode, wherein the first and second circuit matching devices are selected from the group consisting of a capacitor, inductor, transmission line and a combination thereof.

9. The bandpass filter of claim 1, wherein both the first and second core layers include a bondply layer.

10. The bandpass filter of claim 1, wherein the organic dielectric layer comprises multiple layers of organic material, and wherein at least a portion of a passive device is form on each respective layer of the multiple layers of organic material.

11. The bandpass filter of claim 1, wherein the organic dielectric layer comprises a first patterned metal layer and a second patterned metal layer formed on opposites surfaces thereof, and further comprises at least one via electrically connecting the first patterned metal layer and the second patterned metal layer.

12. The bandpass filter of claim 1, further comprising a first protective layer formed on the first shield electrode and a second protective layer formed on the second shield electrode.

13. The bandpass filter of claim 1, wherein the side shield electrode comprises a third shield electrode and fourth shield electrode formed on opposite side surfaces of the filter.

14. The bandpass filter of claim 1, wherein the side shield electrode comprises an in-built shield electrode on the organic dielectric layer that is coplanar with at least a portion of the resonators.

15. The bandpass filter of claim 14, wherein at least one resonator includes a capacitor, and the capacitor includes a first plate on a first surface of the organic dielectric layer and a corresponding ground plate on the opposite surface of the organic dielectric layer, and wherein the in-built shield is disposed on the first surface in proximity of the first plates and is electrically connected to the second plates by vias in the organic dielectric layer.

16. The bandpass filter of claim 1, further comprising an additional resonator formed by one of an inductor, transmission line, capacitor or a combination thereof.

17. The bandpass filter of claim 1, further comprising a plurality of poles formed by one of an inductor, transmission line, capacitor or a combination thereof.

18. An organic bandpass filter, comprising:

a protective layer having an upper surface and a lower surface;

a core layer having an upper surface and a lower surface, wherein the core layer and the protective layer are position opposite one another so that the lower surface of the protective layer is facing the upper surface of the core layer;

an organic dielectric layer having at least two resonators, wherein two of the resonators are coupled to each other, the organic dielectric layer being arranged between the core layer and the protective layer;

a first shield electrode on the lower surface of the core layer opposite the organic dielectric layer;

a side shield electrode in electrical contact with the first shield electrode;

a plurality of solder balls on the protective layer; and

through holes that electrically connect at least one solder ball to the first shield electrode.

19. The bandpass filter of claim 18, wherein the resonators are coupled magnetically, electrically or a combination thereof.

20. The bandpass filter of claim 18, wherein the resonators comprise a combination of transmission lines, inductors and capacitors.

21. The bandpass filter of claim 18, wherein the resonators are formed by transmission line.

22. The bandpass filter of claim 18, wherein the resonators are formed by inductors.

23. The bandpass filter of claim 18, wherein each of the resonators comprises an inductor connected to a parallel plate capacitor, wherein the capacitors include disconnected plates sandwiching the organic dielectric layer.

24. The bandpass filter of claim 18, further comprising an external input terminal electrode and an external output terminal electrode formed on the protective layer, wherein the terminal electrodes are connected to separate solder balls.

25. The bandpass filter of claim 24, wherein the organic dielectric layer includes a circuit matching device connected to the external input terminal electrode and a second circuit matching device connected to the external output terminal electrode, wherein the first and second circuit matching devices are selected from the group consisting of a capacitor, inductor, transmission line and a combination thereof.

26. The bandpass filter of claim 18, wherein the core layers include a bondply layer.

27. The bandpass filter of claim 18, wherein the organic dielectric layer comprises multiple layers of organic material, and wherein at least a portion of a passive device is form on each respective layer of the multiple layers of organic material.

28. The bandpass filter of claim 18, wherein the organic dielectric layer comprises a first patterned metal layer and a second patterned metal layer formed on opposites surfaces thereof, and further comprises at least one via electrically connecting the first patterned metal layer and the second patterned metal layer.

29. The bandpass filter of claim 18, wherein the protective layer comprises an organic material.

30. The bandpass filter of claim 18, wherein the side shield electrode comprises a second shield electrode and third shield electrode formed on opposite side surfaces of the filter.

31. The bandpass filter of claim 18, wherein the side shield electrode comprises an in-built shield electrode on the organic dielectric layer that is coplanar with at least a portion of the resonators.

32. The bandpass filter of claim 31, wherein at least one resonator includes a capacitor, and the capacitor includes a first plate on a first surface of the organic dielectric layer and a corresponding ground plate on the opposite surface of the organic dielectric layer, and wherein the in-built shield is disposed on the first surface of the organic dielectric layer in proximity of the first plates and is electrically connected to the second plates by vias in the organic dielectric layer.

33. The bandpass filter of claim 18, further comprising an additional resonator formed by one of an inductor, transmission line, capacitor or a combination thereof.

34. The bandpass filter of claim 18, further comprising a plurality of poles formed by one of an inductor, transmission line, capacitor or a combination thereof.

35. A stand-alone organic passive device, comprising:

a first core layer having an upper surface and a lower surface;

a second core layer having an upper surface and a lower surface, wherein the first core layer and the second core layer are position opposite one another so that the lower surface of the first core layer is facing the upper surface of the second core layer;

an organic dielectric layer having at least on passive device, the organic dielectric layer being arranged between the first core layer and the second core layer;

a first shield electrode on the upper surface of the first core layer opposite the organic dielectric layer;

a second shield electrode on the lower surface of the second core layer opposite the organic dielectric layer; and

a side shield electrode in electrical contact with the first and second shield electrodes.

36. A stand-alone organic passive device, comprising:

a protective layer having an upper surface and a lower surface;

a core layer having an upper surface and a lower surface, wherein the core layer and the protective layer are position opposite one another so that the lower surface of the protective layer is facing the upper surface of the core layer;

an organic dielectric layer having at least one passive device, the organic dielectric layer being arranged between the core layer and the protective layer;

a first shield electrode on the lower surface of the core layer opposite the organic dielectric layer;

a side shield electrode in electrical contact with the first shield electrode;

a plurality of solder balls on the protective layer; and

through holes that electrically connect at least one solder ball to the first shield electrode.