High efficiency resonant line

• US 20040000976A1
• Filed: 06/27/2002
• Published: 01/01/2004
• Est. Priority Date: 06/27/2002
• Status: Active Grant

• Current Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Original Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Inventors: Pike, Randy T., Killen, William D.
• Granted Patent: US 6,963,259 B2
• Time in Patent Office: Days
• US Class Current: 333/219
• CPC Class Codes: H01P 1/2039 Galvanic coupling between Input/Output
• CPC Class Codes: H01P 1/215 using ferromagnetic material
• CPC Class Codes: H01P 5/02 with invariable factor of coupling H01P5/12 takes precedence choke joints H01P1/04, H01P1/06
• CPC Class Codes: H05K 1/0239 Signal transmission by AC coupling
• CPC Class Codes: H05K 1/024 Dielectric details, e.g. changing the dielectric material around a transmission line
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/165 incorporating printed inductors
• CPC Class Codes: H05K 2201/0187 with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
• CPC Class Codes: H05K 2201/0715 provided by an outer layer of PCB

Abstract

The present invention relates to a circuit for processing radio frequency signals. The resonant circuit includes a substrate. The substrate can be a meta material and can incorporate at least one substrate layer. A resonant line and at least one ground can be coupled to the substrate. An end of the resonant line can electrically shorted to the ground or electrically open with respect to ground. The substrate layer can include a first region with a first set of substrate properties and at least a second region with a second set of substrate properties. At least a portion of the resonant line can be coupled to the second region. The first and/or second set of substrate properties can be differentially modified to vary a permittivity and/or a permeability over a selected region. A third region can be provided with a third set of substrate properties as well.

Claims

1. A circuit for processing radio frequency signals, comprising:

a substrate where said circuit can be placed, said substrate including at least one substrate layer, said substrate layer having a first set of substrate properties over a first region, and at least a second set of substrate properties over a second region, said second set of substrate properties providing different substrate characteristics than said first set of substrate properties;

at least one ground coupled to said substrate; and

,

a resonant line;

wherein at least a portion of said resonant line is coupled to said second region.

2. The circuit of claim 1 wherein said substrate comprises meta material.

3. The circuit of claim 1 wherein an end of said resonant line is electrically shorted to said ground.

4. The circuit of claim 1 wherein said resonant line is electrically open with respect to ground.

5. The circuit of claim 1 wherein at least one of said first set of substrate properties and said second set of substrate properties is differentially modified to vary at least one of a permittivity and a permeability over a selected region.

6. The circuit of claim 1 wherein said first set of substrate properties comprises a first permittivity and said second set of substrate properties comprises a second permittivity, said second permittivity being at least one of higher and lower than said first permittivity.

7. The circuit of claim 6 wherein a size of said resonant line is smaller than a resonant line coupled exclusively to said first region and having electrical characteristics equivalent to electrical characteristics of said resonant line.

8. The circuit of claim 1 wherein said first set of substrate properties comprises a first permeability and said second set of substrate properties comprises a second permeability, said second permeability being at least one of higher and lower than said first permeability.

9. The circuit of claim 8 wherein a size of said resonant line is smaller than a resonant line coupled exclusively to said first region and having electrical characteristics equivalent to electrical characteristics of said resonant line.

10. The circuit of claim 1 wherein said substrate further includes at least a third set of substrate properties over a third region, said third set of substrate properties providing different substrate characteristics than said first and second sets of substrate properties.

11. The circuit of claim 10 wherein at least a portion of said resonant line is coupled to said third region.

12. The circuit of claim 11 wherein said third set of substrate properties comprises a third permittivity and said second set of substrate properties comprises a second permittivity, said third permittivity being at least one of higher and lower than said second permittivity.

13. The circuit of claim 11 wherein said third set of substrate properties comprises a third permeability and said second set of substrate properties comprises a second permeability, said third permeability being at least one of higher and lower than said second permeability.