Apparatus and system for providing optical bus interprocessor interconnection

• US 20040001676A1
• Filed: 06/28/2002
• Published: 01/01/2004
• Est. Priority Date: 06/28/2002
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Stigliani, Daniel J. Jr., Colgan, Evan G.
• Granted Patent: US 6,752,539 B2
• Time in Patent Office: Days
• US Class Current: 385/92
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections

Abstract

An exemplary embodiment of the present invention is an apparatus for providing optical interprocessor communication. The apparatus comprises a multichip module and an optical module. The multichip module includes a substrate, an integrated circuit electrically connected to the substrate and a hermetically sealed cover. The hermetically sealed cover encloses a sealed portion of the substrate and the integrated circuit is inside of the sealed cover. The optical module includes an optical transceiver located on the substrate outside of the sealed portion and the optical transceiver is electrically connected to the integrated circuit through the substrate.

Claims

1. An apparatus for providing optical interprocessor communication, said apparatus comprising:

a multichip module including;

a substrate;

an integrated circuit electrically connected to said substrate; and

a hermetically sealed cover, wherein said hermetically sealed cover encloses a sealed portion of said substrate and wherein said integrated circuit is inside of said sealed cover; and

an optical module, wherein said optical module includes an optical transceiver located on said substrate outside of said sealed portion and wherein said optical transceiver is electrically connected to said integrated circuit through said substrate.

2. The apparatus of claim 1 wherein said optical transceiver includes a transmitter module and a receiver module.

3. The apparatus of claim 1 wherein said substrate is a ceramic substrate.

4. The apparatus of claim 1 wherein said substrate is an organic substrate.

5. The apparatus of claim 1 wherein said optical transceiver is fabricated on a ceramic carrier.

6. The apparatus of claim 1 wherein said optical transceiver is fabricated on an organic carrier.

9. The apparatus of claim 1 wherein said optical module further includes an optical fiber integrated into said optical transceiver.

10. The apparatus of claim 9 wherein said optical fiber is a pigtail fiber optics cable including a plurality of link fibers.

11. The apparatus of claim 9 wherein said optical fiber is located on said substrate outside of said sealed portion.

12. The apparatus of claim 9 wherein said optical module further includes an optical connector attached to said optical fiber.

13. The apparatus of claim 12 wherein said optical connector is a remote connector.

14. The apparatus of claim 1 wherein said optical module further includes an optical connector integrated into said optical transceiver.

7. The apparatus of claim I wherein said optical transceiver is electrically connected to said integrated circuit through said substrate using a high density electrical interconnection.

8. The apparatus of claim 7 wherein said high density electrical interconnection is a C4 connection.

15. A system for providing optical interprocessor communication, said system comprising:

a local multichip module including;

a substrate;

an integrated circuit electrically connected to said substrate; and

a hermetically sealed cover, wherein said hermetically sealed cover encloses a sealed portion of said substrate and wherein said integrated circuit is inside of said sealed cover;

an optical module, wherein said optical module includes an optical transceiver located on said substrate outside of said sealed portion and wherein said optical transceiver is electrically connected to said integrated circuit through said substrate; and

a computer circuit including instructions to format and send data from said local multichip module to a remote multichip module.

16. The system of claim 15 wherein said remote multichip module and said local multichip module are located on the same node.

17. The system of claim 15 wherein said remote multichip module and said local multichip module are located on different nodes within the same system.

18. The system of claim 15 wherein said remote multichip module and said local multichip module are located on different systems.

19. The system of claim 15 wherein said computer circuit includes further instructions to receive data at said local multichip module from said remote multichip module.

20. The system of claim 15 wherein said local multichip module further includes said computer circuit.

21. The system of claim 15 wherein said optical module further includes said computer circuit.

22. The system of claim 15 wherein said optical transceiver includes a separate transceiver module and receiver module.

23. A system for providing optical interprocessor communication, said system comprising:

a local multichip module including;

a substrate;

an integrated circuit electrically connected to said substrate; and

a hermetically sealed cover, wherein said hermetically sealed cover encloses a sealed portion of said substrate and wherein said integrated circuit is inside of said sealed cover;

an optical module, wherein said optical module includes an optical transceiver located on said substrate outside of said sealed portion and wherein said optical transceiver is electrically connected to said integrated circuit through said substrate; and

a computer circuit including instructions to receive data at said local multichip module from a remote multichip module.