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Methods and apparatus for verifying circuit board design

  • US 20040003358A1
  • Filed: 06/11/2003
  • Published: 01/01/2004
  • Est. Priority Date: 06/28/2002
  • Status: Active Grant
First Claim
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1. A method for verifying a design of a circuit board having a wiring layer connecting components to be mounted, a power layer, and an insulating layer formed between said wiring layer and said power layer, comprising the steps of:

  • detecting in an opposing region in which said wiring layer and said power layer are opposed to each other, a chipping of said power layer, which corresponds to one wiring layer and interrupts said opposing region;

    computing a common-mode voltage to be expected to be caused at the chipping; and

    outputting a position of the chipping and a value of the common-mode voltage caused owing to the chipping.

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