Methods and apparatus for verifying circuit board design
First Claim
1. A method for verifying a design of a circuit board having a wiring layer connecting components to be mounted, a power layer, and an insulating layer formed between said wiring layer and said power layer, comprising the steps of:
- detecting in an opposing region in which said wiring layer and said power layer are opposed to each other, a chipping of said power layer, which corresponds to one wiring layer and interrupts said opposing region;
computing a common-mode voltage to be expected to be caused at the chipping; and
outputting a position of the chipping and a value of the common-mode voltage caused owing to the chipping.
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Accused Products
Abstract
The present invention provides a method for verifying a design of a circuit board that has a wiring layer connecting components to be mounted, a power layer, and an insulating layer formed between the wiring layer and the power layer. According to this method, detection of chippings in the power layer is performed. The chipping is, for example, a gap, a slot, or a slit, and corresponds to one wiring layer and interrupts a region in which the wiring layer and the power layer are opposed to each other. When chippings are detected, a common-mode voltage expected to be caused owing to each of the chippings is computed. Subsequently, the position of the chipping and the value of the common-mode voltage caused owing to the chipping are outputted. Thus, the priorities of the chippings, to which countermeasure for suppressing radiation of electromagnetic waves should be applied, can easily be decided.
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Citations
15 Claims
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1. A method for verifying a design of a circuit board having a wiring layer connecting components to be mounted, a power layer, and an insulating layer formed between said wiring layer and said power layer, comprising the steps of:
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detecting in an opposing region in which said wiring layer and said power layer are opposed to each other, a chipping of said power layer, which corresponds to one wiring layer and interrupts said opposing region;
computing a common-mode voltage to be expected to be caused at the chipping; and
outputting a position of the chipping and a value of the common-mode voltage caused owing to the chipping. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for verifying a design of a circuit board having a wiring layer connecting components to be mounted, a power layer, an insulating layer formed between said wiring layer and said power layer, and mounting prearranged parts, on which cable-connection connectors are mounted, comprising the steps of:
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detecting in an opposing region in which said wiring layer and said power layer are opposed to each other, a chipping of said power layer, which corresponds to one wiring layer and interrupts said opposing region;
computing, in a case that the chipping is detected, a propagation value of a common-mode voltage expected at the connector when the common-mode voltage generated at the chipping propagates and reaches the connector; and
outputting, according to the computed propagation value, information representing whether or not a countermeasure for suppressing radiation of electromagnetic waves is applied to the connector or a cable connected to the connector. - View Dependent Claims (8)
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9. An apparatus for verifying a design of a circuit board having a wiring layer connecting components to be mounted, a power layer, and an insulating layer formed between said wiring layer and said power layer, comprising:
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a detecting portion for detecting in an opposing region in which said wiring layer and said power layer are opposed to each other, a chipping of said power layer, which corresponds to one wiring layer and interrupts said opposing region;
a computing portion for computing a common-mode voltage to be expected to be caused at the chipping; and
an output portion for outputting a position of the chipping and a value of the common-mode voltage caused owing to the chipping. - View Dependent Claims (10, 11, 12)
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13. An apparatus for verifying a design of a circuit board having a wiring layer connecting components to be mounted, a power layer, an insulating layer formed between said wiring layer and said power layer, and mounting prearranged parts, on which cable-connection connectors are mounted, comprising:
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a detecting portion for detecting in an opposing region in which said wiring layer and said power layer are opposed to each other, a chipping of said power layer, which corresponds to one wiring layer and interrupts said opposing region;
a computing portion for computing, in a case where the chipping is detected, a propagation value of a common-mode voltage expected at the connector when the common-mode voltage generated at the chipping propagates and reaches the connector; and
an output portion for outputting, according to the computed propagation value, information representing whether or not a countermeasure for suppressing radiation of electromagnetic waves is applied to the connector or a cable connected to the connector. - View Dependent Claims (14, 15)
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Specification