High temperature tag having enclosed transceiver

• US 20040004131A1
• Filed: 07/08/2003
• Published: 01/08/2004
• Est. Priority Date: 10/24/2000
• Status: Abandoned Application

• Current Assignee: Moore North America Incorporated (RR Donnelley & Sons Company)
• Original Assignee: Moore North America Incorporated (RR Donnelley & Sons Company)
• Inventors: Emmert, David R.
• Application Number:
  US10/614,192
• Publication Number:
  US 20040004131A1
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: B31D 1/027 involving, marking, printing or coding
• CPC Class Codes: B31D 1/028 Applying RFID chips
• CPC Class Codes: G06K 19/041 Constructional details G06K19/06 takes precedence
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/0773 the record carrier comprising means to protect itself against external heat sources
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A high temperature RFID tag is provided that is adapted to receive thermal transfer print to provide indicia on an outer surface thereof and adapted to be disposed on a part that is subject to high temperature exposure. The RFID tag is formed as a lamination of a high temperature material such as high temperature polyester and including a window for an RFID generator component, a layer of high temperature resistant material that overlies the opening, and an adhesive material disposed in the window to secure the RFID generator component therein. The layer of high temperature resistant material is preferably transparent so that the indicia can be seen therethrough.

Claims

1. A high temperature tag incorporating an electronic device comprising:

a laminated structure including a heat resistant base material having window cut therein;

a heat resistant layer secured to a first surface of said base material;

an adhesive material disposed on at least a portion of said first lamination, said adhesive being disposed in at least a portion of said window; and

an electronic component adhered by said adhesive in said window.

2. A high temperature tag as in claim 1, wherein said base material is a high temperature polyester.

3. A high temperature tag as in claim 1, wherein said heat resistant layer is translucent, at least in part.

4. A high temperature tag as in claim 3, wherein said heat resistant layer is transparent, at least in part.

5. A high temperature tag as in claim 1, wherein said heat resistant layer is a clear, high temperature polyester.

6. A high temperature tag as in claim 1, wherein said heat resistant layer has a width generally corresponding to a width of said base material.

7. A high temperature tag as in claim 1, further comprising indicia on at least one surface of said base material.

8. A high temperature tag as in claim 7, wherein said indicia is printed on said first surface of said base material, said heat resistant layer overlies said indicia, and said heat resistant layer is transparent.