Test assembly including a test die for testing a semiconductor product die
First Claim
1. A test assembly for testing product circuitry of a product die, the test assembly comprising:
- a test die having test circuitry for testing the product circuitry of the product die, the test circuitry generated by;
(i) concurrently designing the test circuitry and the product circuitry into a unified design, (ii) partitioning the test circuitry from the product circuitry, and (iii) fabricating the test circuitry into the test die; and
an interconnection substrate for electrically coupling the test die to a host controller that communicates with the test die.
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Accused Products
Abstract
One embodiment of the present invention concerns a test assembly for testing product circuitry of a product die. In one embodiment, the test assembly includes at test die and an interconnection substrate for electrically coupling the test die to a host controller that communicates with the test die. The test die may be designed according to a design methodology that includes the step of concurrently designing test circuitry and a product circuitry in a unified design. The test circuitry can be designed to provide a high degree of fault coverage for the corresponding product circuitry generally without regard to the amount of silicon area that will be required by the test circuitry. The design methodology then partitions the unified design into the test die and the product die. The test die includes the test circuitry and the product die includes the product circuitry. The product and test die may then be fabricated on separate semiconductor wafers. By partitioning the product circuitry and test circuitry into separate die, embedded test circuitry can be either eliminated or minimized on the product die. This will tend to decrease the size of the product die and decrease the cost of manufacturing the product die while maintaining a high degree of test coverage of the product circuits within the product die. The test die can be used to test multiple product die on one or more wafers.
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Citations
39 Claims
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1. A test assembly for testing product circuitry of a product die, the test assembly comprising:
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a test die having test circuitry for testing the product circuitry of the product die, the test circuitry generated by;
(i) concurrently designing the test circuitry and the product circuitry into a unified design, (ii) partitioning the test circuitry from the product circuitry, and (iii) fabricating the test circuitry into the test die; and
an interconnection substrate for electrically coupling the test die to a host controller that communicates with the test die. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A test assembly for testing product circuitry of a product die, the test assembly comprising:
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a first test die having test circuitry for testing the product circuitry of the product die;
a second test die having test circuitry for testing the product circuitry of the product die; and
an interconnection substrate for electrically coupling the first test die and second test die to a host controller.
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20. A test assembly for testing product circuitry of a plurality of product die, the test assembly comprising:
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a test die having test circuitry for testing the product circuitry of the plurality product die; and
an interconnection substrate for electrically coupling the test die to a host controller that communicates with the test die. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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32. A test assembly comprising:
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a first test die having test circuitry for testing product circuitry of a first product die;
a second test die having test circuitry for testing product circuitry of a second product die;
a third test die having circuitry for providing communicating test signals with the first and second test die; and
an interconnection substrate for electrically coupling the first, second, and third test die. - View Dependent Claims (33, 34)
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35. A test assembly for testing product circuitry of a product die, the test assembly comprising:
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a test die having test circuitry for testing the product circuitry of the product die, the test circuitry generated by;
(i) concurrently designing the test circuitry and the product circuitry into a unified design, (ii) partitioning the test circuitry from the product circuitry, and (iii) fabricating the test circuitry into the test die;
a contactor having contact elements for electrically coupling signals from the test circuitry to the product circuitry; and
an interconnection substrate for electrically coupling the test die to the contactor. - View Dependent Claims (36, 37, 38, 39)
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Specification