Immersion cooling type light emitting diode and its packaging method

• US 20040004435A1
• Filed: 07/04/2002
• Published: 01/08/2004
• Est. Priority Date: 01/29/2002
• Status: Abandoned Application

• Current Assignee: Chi-Hsing Hsu
• Original Assignee: Chi-Hsing Hsu
• Inventors: Hsu, Chi-Hsing
• Application Number:
  US10/064,358
• Publication Number:
  US 20040004435A1
• Time in Patent Office: Days
• US Class Current: 313/512
• CPC Class Codes: F21V 29/58 characterised by the coolants
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/451 with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4823 connecting the wire to a pin of the item
• CPC Class Codes: H01L 23/44 the complete device being wholly immersed in a fluid other than air H01L23/427 takes precedence
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01019 Potassium [K]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12036 PN diode
• CPC Class Codes: H01L 2924/12041 LED
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 33/642 : characterized by the shape
• CPC Class Codes: H01L 33/647 : the elements conducting electric current to or from the semiconductor body
• CPC Class Codes: H10K 50/87 : Arrangements for heating or cooling

Abstract

An immersion cooling type diode device has a diode chip, a diode chip carrier for carrying the diode chip, a lead frame connected to the diode chip carrier, at least one metal wire bond, a base, a round-shaped transparent cap with a cylinder wall for covering the base to form a cavity, a cooling liquid filled in the cavity, and a heat sink for dissipating heat generated by the diode chip. The cooling liquid directly contacts with the diode chip and the metal wire bond, and the diode chip is either one of a light emitting diode (LED) chip, a vertical emitting type laser diode chip, an edge emitting type laser diode chip, a polymer molecule LED chip or a smaller organic molecule LED chip.

Claims

1. An immersion cooling type diode device comprising a diode chip, a diode chip carrier for carrying the diode chip, a lead frame connected to the diode chip carrier, a base, a round-shaped transparent cap with a cylinder wall for covering the base to form a cavity, a cooling liquid filled in the cavity, and a heat sink for dissipating heat generated by the diode chip, wherein the cooling liquid directly contacts with the diode chip and the metal wire bond.

2. The immersion cooling type diode device of claim 1 wherein the diode chip is either one of a light emitting diode (LED) chip, a vertical emitting type laser diode chip, an edge emitting type laser diode chip, a polymer molecule LED chip or a smaller organic molecule LED chip.

3. The immersion cooling type diode device of claim 1 wherein the diode chip is packaged by utilizing at least one metal wire bond.

4. The immersion cooling type diode device of claim 1 wherein the diode chip is packaged by using a flip chip method.

5. The immersion cooling type diode device of claim 3 wherein the diode chip and the metal wire bond comprise an insulating surface.

6. The immersion cooling type diode device of claim 1 comprising either one of a transparent concave-shaped, a convex-shaped or a flat-top-shaped cape with a cylindrical wall.

7. The immersion cooling type diode device of claim 6 wherein the cylindrical wall is employed as a heat sink, and a fin-type heat sink is molded to an outer surface of the cylinder wall to reinforce the heat dissipation of the immersion cooling type diode device.

8. The immersion cooling type diode device of claim 1 comprising a plurality of the LED chips.

9. The immersion cooling type diode device of claim 1 wherein the immersion cooling type diode device is either one of a lead frame type LED device or a surface mounting type (SMT) LED device and is applied by combining multiple liquid-cooled LED devices to form either a strip or a planar light source module in LED lighting products needing excellent brightness performances.