Immersion cooling type light emitting diode and its packaging method
First Claim
1. An immersion cooling type diode device comprising a diode chip, a diode chip carrier for carrying the diode chip, a lead frame connected to the diode chip carrier, a base, a round-shaped transparent cap with a cylinder wall for covering the base to form a cavity, a cooling liquid filled in the cavity, and a heat sink for dissipating heat generated by the diode chip, wherein the cooling liquid directly contacts with the diode chip and the metal wire bond.
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Abstract
An immersion cooling type diode device has a diode chip, a diode chip carrier for carrying the diode chip, a lead frame connected to the diode chip carrier, at least one metal wire bond, a base, a round-shaped transparent cap with a cylinder wall for covering the base to form a cavity, a cooling liquid filled in the cavity, and a heat sink for dissipating heat generated by the diode chip. The cooling liquid directly contacts with the diode chip and the metal wire bond, and the diode chip is either one of a light emitting diode (LED) chip, a vertical emitting type laser diode chip, an edge emitting type laser diode chip, a polymer molecule LED chip or a smaller organic molecule LED chip.
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Citations
9 Claims
- 1. An immersion cooling type diode device comprising a diode chip, a diode chip carrier for carrying the diode chip, a lead frame connected to the diode chip carrier, a base, a round-shaped transparent cap with a cylinder wall for covering the base to form a cavity, a cooling liquid filled in the cavity, and a heat sink for dissipating heat generated by the diode chip, wherein the cooling liquid directly contacts with the diode chip and the metal wire bond.
Specification