Device and method for electronic device test

• US 20040004493A1
• Filed: 05/19/2003
• Published: 01/08/2004
• Est. Priority Date: 11/20/2000
• Status: Active Grant

• Current Assignee: Advantest Corporation
• Original Assignee: Advantest Corporation
• Inventors: Furukawa, Yasuo
• Granted Patent: US 7,071,721 B2
• Time in Patent Office: Days
• US Class Current: 324/765
• CPC Class Codes: G01R 31/30 Marginal testing, e.g. by varying supply voltage testing computers during standby operation or idle time G06F11/22
• CPC Class Codes: G01R 31/3008 Quiescent current [IDDQ] test or leakage current test
• CPC Class Codes: G01R 31/3173 Marginal testing
• CPC Class Codes: G01R 31/318505 Test of Modular systems, e.g. Wafers, MCM's
• CPC Class Codes: G01R 31/318511 Wafer Test
• CPC Class Codes: G01R 31/319 Tester hardware, i.e. output processing circuits

Abstract

A test device tests acceptability of a plurality of electronic devices formed on a wafer. The test device includes: a pattern supply part for supplying test patterns to each of the plurality of electronic devices; a power supply for applying power supply voltage to each of the plurality of electronic devices; a measurement part for measuring the data indicating the operations of each of the electronic devices generated by the test patterns; a calculation part for calculating the reference values for judging the acceptability of each of the electronic devices; and a judgment part for judging the acceptability of each of the electronic devices.

Claims

1. A test device for testing a plurality of electronic devices formed on a wafer, comprising:

a pattern supply part for supplying a test pattern to each of the plurality of electronic devices;

a measurement part for measuring data indicating operation of each of the electronic devices generated from the test pattern; and

a judgment part for judging acceptability of other electronic devices based on the data of at least one of the electronic devices among the plurality of electronic devices.

2. The test device as claimed in claim 1, further comprising a calculation part for calculating a reference value for judging the acceptability of each of the electronic devices using the data of the plurality of electronic devices,

wherein said judgment part judges the acceptability of each of the electronic devices using the reference value and the data of each of the electronic devices.

3. The test device as claimed in claim 2, wherein said calculation part selects an electronic device used for calculation of the reference value, and calculates the reference value using the data of the selected electronic device.

4. The test device as claimed in claim 1, wherein

said measurement part measures a value of current flowing to the electronic devices by supplying the test pattern, and

said calculation part calculates the reference value based on the current value measured by said measurement part.

5. The test device as claimed in claim 1, wherein said measurement part measures analog output values output from the electronic devices.

6. The test device as claimed in claim 5, wherein

said measurement part further comprises an offset value storage part for storing an offset value of the analog output, and

said calculation part calculates the reference value based on the offset value and the data.

7. The test device as claimed in the claim 1, wherein said measurement part measures a frequency of a signal output from the electronic devices.

8. The test device as claimed in claim 2, further comprising:

a data storing part for storing the data; and

a heating part for heating the electronic devices, wherein said calculation part calculates the reference value based on the data stored in said data storing part and the data after heated by said heating part.

9. The test device as claimed in claim 2, further comprising a cooling part for cooling the electronic devices after heated by said heating part, wherein

said data storing part further stores the data after heated by said heating part, and

said calculation part calculates the reference value based on at least one of the data before and after heated by said heating part, the data being stored in said data storing part, and the data after cooled by said cooling part.

10. The test device as claimed in claim 1, wherein

said measurement part measures a position of each of the electronic devices on the wafer in association with the data, and

said judgment part judges the acceptability of each of the electronic devices based on the position.

11. The test device as claimed in claim 2, wherein

said calculation part divides the wafer into a plurality of areas and calculates the reference value for each of the areas, and

said judgment part judges the acceptability of the electronic devices for each of the areas.

12. The test device as claimed in claim 2, further comprising a wafer data storing part for storing the data for each of wafers, wherein

said measurement part measures the data of the plurality of wafers,

said wafer data storing part stores the data of the plurality of wafers respectively, and

said calculation part calculates the reference value based on the data stored in said wafer data storing part.

13. The test device as claimed in claim 12, wherein the plurality of wafers are manufactured in a production lot.

14. A test method for testing a plurality of electronic devices formed on a wafer, comprising steps of:

inputting a test pattern to each of the plurality of electronic devices;

measuring data indicating operation of each of the electronic devices generated from the test pattern; and

judging acceptability of other electronic devices based on the data of at least one of the electronic devices among the plurality of electronic devices.

15. The test method of the electronic devices as claimed in claim 14, further comprising a step of calculating a reference value for judging the acceptability of each of the electronic devices using the data of the plurality of electronic devices, wherein

the acceptability of each of the electronic devices is judged in said judgment step using the reference value and the data of each of the electronic devices.

16. The test method of the electronic devices as claimed in claim 15, wherein

a value of current flowing to the electronic devices is measured in said measurement step by supplying the test pattern, and

the reference value is calculated in said calculation step based on the current value measured in said measurement step.

17. The test method of the electronic devices as claimed in claim 15, further comprising a step of heating the electronic devices, wherein

the reference value is calculated in said calculating step based on the data measured in said measurement step after heating the electronic device in said heating step.

18. The test method of the electronic devices as claimed in claim 15, wherein

a position of each of the electronic devices on the wafer is measured in said measurement step in association with the data, and

the acceptability of each of the electronic devices is judged in said judgment step based on the position on the wafer.