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Method and apparatus for endpoint detection

  • US 20040005769A1
  • Filed: 07/03/2002
  • Published: 01/08/2004
  • Est. Priority Date: 07/03/2002
  • Status: Abandoned Application
First Claim
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1. A method for endpoint detection in chemical mechanical planarization of a substrate having a first layer of material and a second layer of material, wherein the second layer of material has an exposed surface that is planarized by a method comprising:

  • (a) placing a target at or near a location between the first layer of material and the second layer of material;

    (b) planarizing the second layer of material to remove at least a portion of material from the second layer;

    (c) detecting the target; and

    (d) adjusting said planarizing step in response to detecting the target.

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