Resonant energy MEMS array and system including dynamically modifiable power processor

• US 20040007942A1
• Filed: 05/13/2003
• Published: 01/15/2004
• Est. Priority Date: 05/13/2002
• Status: Active Grant

• Current Assignee: University of Florida Research Foundation, Incorporated (State University System of Florida)
• Original Assignee: University of Florida Research Foundation, Incorporated (State University System of Florida)
• Inventors: Nishida, Toshikazu, Sheplak, Mark, Ngo, Khai D. T., Cattafesta, Louis N. III
• Granted Patent: US 6,954,025 B2
• Time in Patent Office: Days
• US Class Current: 310/314
• CPC Class Codes: H02N 2/181 Circuits; Control arrangements or methods
• CPC Class Codes: H02N 2/188 adapted for resonant operation
• CPC Class Codes: H10N 39/00 Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00

Abstract

An integrated MEMS resonant generator system includes a substrate, a plurality of piezoelectric micro generators disposed on the substrate, the micro generators each generating a voltage output in response to vibrational energy received, and at least one power processor disposed on the substrate. The power processor electrically coupled to outputs of the plurality of micro generators. When the input conditions change, the power processor can dynamically adjust its switching functions to optimize the power delivered to a load or energy storage reservoir.

Claims

1. An integrated MEMS resonant generator-based system, comprising:

a substrate;

a plurality of piezoelectric micro generators disposed on said substrate, said micro generators each generating a voltage output in response to vibrational energy received, and

at least one power processor disposed on said substrate, said power processor electrically coupled to outputs of said plurality of micro generators.

2. The system of claim 1, wherein said plurality of micro generators collectively provide more than one resonant frequency.

3. The system of claim 1, wherein said power processor includes structure for providing a dynamically adjustable switching function.

4. The system of claim 3, wherein said power processor includes a rectifier for providing a rectified output voltage from said voltage output and a controller which includes a peak detector, dynamic switching of said power processor being based on said peak detector determining instants when said rectified voltage is at a peak value.

5. The system of claim 3, wherein said power processor includes a controller which dynamically adjusts an input impedance of said power processor, said input impedance dynamically matching output impedances of said plurality of micro generators.

6. The system of claim 3, wherein said power processor includes a controller which dynamically maximizes charge transferred into a load or an energy reservoir.

7. The system of claim 1, wherein said substrate is single crystal silicon die.

8. The system of claim 1, wherein said plurality of micro generators are interconnected to form sub-arrays comprising groups of said plurality of micro generators.

9. The system of claim 8, wherein said power processor includes a plurality of reconfigurable switches, said plurality of reconfigurable switches dynamically alterable groupings of said plurality of micro generators to form reconfigurable ones of said sub-arrays.

10. The system of claim 1, wherein a switching frequency of said power processor is from 100 Hz to 1 kHz.

11. The system of claim 1, wherein said power processor provides an inductor, wherein an inductance of said inductor is less than 100 nH.

12. The system of claim 5, wherein said system provides a power conversion efficiency of at least 75%.

13. An integrated MEMS resonant generator array, comprising:

a plurality of piezoelectric micro generators disposed on a substrate, said micro generators each generating a voltage output in response to vibrational energy received, and

at least one summing node disposed on said substrate, said summing node electrically coupled to outputs of said plurality of micro generators.

14. The array of claim 13, wherein said plurality of micro generators collectively provide more than one resonant frequency.

15. The array of claim 13, wherein said substrate is single crystal silicon die.

16. A method of generating electrical energy from vibrational energy, comprising the steps of:

providing an integrated MEMS resonant generator system comprising a substrate, a plurality of piezoelectric micro generators disposed on said substrate, said micro generators each generating a voltage output in response to vibrational energy received, and at least one power processor disposed on said substrate, said power processor electrically coupled to outputs of said plurality of micro generators;

subjecting said system to vibrational energy, and

providing electrical energy from said plurality of voltage outputs.

17. The method of claim 16, wherein said plurality of micro generators collectively provide more than one resonant frequency.

18. The method of claim 16, further comprising the steps of sensing a change in said vibrational energy and dynamically adjusting a switching function of said power processor to maximize power delivered to a load or an energy storage device.

19. The method of claim 16, wherein said substrate is single crystal silicon die.

20. The method of claim 16, further comprising the step of dynamically reconfiguring at least one connection between said plurality of micro generators.