Backlight module structure

• US 20040008504A1
• Filed: 07/10/2002
• Published: 01/15/2004
• Est. Priority Date: 05/27/2002
• Status: Active Grant

• Current Assignee: Wintek Corporation
• Original Assignee: Wintek Corporation
• Inventors: Wang, Chih-Yuan, Huang, Kuo Jui
• Granted Patent: US 6,752,507 B2
• Time in Patent Office: Days
• US Class Current: 362/31
• CPC Class Codes: G02B 6/0026 Wavelength selective element, sheet or layer, e.g. filter or grating
• CPC Class Codes: G02B 6/0038 Linear indentations or grooves, e.g. arc-shaped grooves or meandering grooves, extending over the full length or width of the light guide
• CPC Class Codes: G02B 6/005 provided by one optical element, or plurality thereof, placed on the light output side of the light guide
• CPC Class Codes: G02B 6/0053 Prismatic sheet or layer; Brightness enhancement element, sheet or layer
• CPC Class Codes: G02B 6/0065 Manufacturing aspects; Material aspects

Abstract

A backlight module structure is including a photoconductive element. The top of the photoconductive element has an outgoing face formed with numerous microstructures. An optical transforming layer is overlaid on the outgoing face of the photoconductive element between the outgoing face and the liquid crystal module. A solid powder material is mixed with a polymer binder and adhered to a transparent substrate to form the optical transforming layer. The solid powder material includes at least a lighting material.

Claims

1. A backlight module structure comprising a photoconductive element made of transparent material, a top section of the photoconductive element having an outgoing face formed with numerous microstructures, the bottom of the photoconductive element being formed with a photoconductive face, an incoming face being formed on a lateral face of the photoconductive element, a light source being disposed on one side of the incoming face, an optical transforming layer being overlaid on the outgoing face of the photoconductive element, the optical transforming layer being composed of a solid powder material, a polymer binder and a transparent substrate, the solid powder material including at least a lighting material.

2. The backlight module structure as claimed in claim 1, wherein the microstructure has a peak point farthest from the outgoing face, the microstructure inclinedly radially extending from the peak point, all the tangents of outer faces of the microstructure being not parallel to each other, one side of the peak being formed with a steep slope, while the other side of the peak opposite to the steep slope being formed with a gradual slope, the tangent of the gradual slope and the outgoing face containing a first angle, the tangent of the steep slope and the outgoing face containing a second angle which is larger than the first angle.

3. The backlight module structure as claimed in claim 1, wherein the photoconductive face of the bottom of the photoconductive element is inclined, whereby the thickness of the photoconductive element is tapered in accordance with the photoconductive face to form a thick end and a thin end.

4. The backlight module structure as claimed in claim 1, wherein an arched reflective mirror is disposed on one side of the light source distal from the photoconductive element.

5. The backlight module structure as claimed in claim 1, wherein the polymer binder is one of epoxy resin, polyamide resin, acryl resin, polyester resin, polyether resin, halogen resin, rubber, silicone resin and cellulose resin, the concentration thereof being 20˜

90% weight percentage.

6. The backlight module structure as claimed in claim 1, wherein the solid powder material further includes an optical powder which is one of pigment, dyne, acryl powder, TiO₂, SiO₂ and BaTiO₃, the concentration thereof being 0.5˜

50% weight percentage.