Multiplex laser-light source and exposure system
First Claim
1. A laser-light source comprising:
- a heat-dissipation block made of copper or copper alloy;
a plurality of submounts which are made of a material having a thermal expansion coefficient of 3.5 to 6.0×
10−
6/°
C., have a thickness of 200 to 400 micrometers, and are separately formed on said heat-dissipation block;
a plurality of semiconductor lasers each of which is made of a nitride compound, has a single cavity and a form of a chip, and is mounted junction-side-down on one of said plurality of submounts;
a multimode optical fiber; and
an optical condenser system which collects laser beams emitted from said plurality of semiconductor lasers, and couples the collected laser beams to said multimode optical fiber;
wherein each of said plurality of semiconductor lasers and said plurality of submounts has a bonding surface, and the bonding surface of each of the plurality of semiconductor lasers is bonded to the bonding surface of one of the plurality of submounts through a metalization layer and an Au—
Sn eutectic solder layer each of which is divided into a plurality of areas.
3 Assignments
0 Petitions
Accused Products
Abstract
In a laser-light source: submounts each being made of a material having a thermal expansion coefficient of 3.5 to 6.0×10−6/° C. and having a thickness of 200 to 400 micrometers are separately formed on a heat-dissipation block made of copper or copper alloy; a single-cavity nitride-based semiconductor laser chips are respectively mounted junction-side-down on the corresponding submounts; an optical condenser system collects laser beams emitted from the semiconductor laser chips, and couples the collected laser beams to a multimode optical fiber. A bonding surface of each semiconductor laser chip is bonded to a bonding surface of a corresponding submount through a metalization layer and an Au—Sn eutectic solder layer each of which is divided into areas.
43 Citations
19 Claims
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1. A laser-light source comprising:
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a heat-dissipation block made of copper or copper alloy;
a plurality of submounts which are made of a material having a thermal expansion coefficient of 3.5 to 6.0×
10−
6/°
C., have a thickness of 200 to 400 micrometers, and are separately formed on said heat-dissipation block;
a plurality of semiconductor lasers each of which is made of a nitride compound, has a single cavity and a form of a chip, and is mounted junction-side-down on one of said plurality of submounts;
a multimode optical fiber; and
an optical condenser system which collects laser beams emitted from said plurality of semiconductor lasers, and couples the collected laser beams to said multimode optical fiber;
wherein each of said plurality of semiconductor lasers and said plurality of submounts has a bonding surface, and the bonding surface of each of the plurality of semiconductor lasers is bonded to the bonding surface of one of the plurality of submounts through a metalization layer and an Au—
Sn eutectic solder layer each of which is divided into a plurality of areas. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
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16. A laser-light source comprising a plurality of laser-light-source portions each of which includes:
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a heat-dissipation block made of copper or copper alloy;
a plurality of submounts which are made of a material having a thermal expansion coefficient of 3.5 to 6.0×
10−
6/°
C., have a thickness of 200 to 400 micrometers, and are separately formed on said heat-dissipation block;
a plurality of semiconductor lasers each of which is made of a nitride compound, has a single cavity and a form of a chip, and is mounted junction-side-down on one of said plurality of submounts;
a multimode optical fiber; and
an optical condenser system which collects laser beams emitted from said plurality of semiconductor lasers, and couples the collected laser beams to said multimode optical fiber;
wherein each of said plurality of semiconductor lasers and said plurality of submounts has a bonding surface, the bonding surface of each of the plurality of semiconductor lasers is bonded to the bonding surface of one of the plurality of submounts through a metalization layer and an Au—
Sn eutectic solder layer each of which is divided into a plurality of areas, and said multimode optical fiber in the plurality of laser-light-source portions is arranged to constitute a one-dimensional array at least at a light-emission end of the multimode optical fiber.
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17. A laser-light source comprising a plurality of laser-light-source portions each of which includes:
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a heat-dissipation block made of copper or copper alloy;
a plurality of submounts which are made of a material having a thermal expansion coefficient of 3.5 to 6.0×
10−
6/°
C., have a thickness of 200 to 400 micrometers, and are separately formed on said heat-dissipation block;
a plurality of semiconductor lasers each of which is made of a nitride compound, has a single cavity and a form of a chip, and is mounted junction-side-down on one of said plurality of submounts;
a multimode optical fiber; and
an optical condenser system which collects laser beams emitted from said plurality of semiconductor lasers, and couples the collected laser beams to said multimode optical fiber;
wherein each of said plurality of semiconductor lasers and said plurality of submounts has a bonding surface, the bonding surface of each of the plurality of semiconductor lasers is bonded to the bonding surface of one of the plurality of submounts through a metalization layer and an Au—
Sn eutectic solder layer each of which is divided into a plurality of areas, and said multimode optical fiber in the plurality of laser-light-source portions is arranged to constitute a bundle at least at a light-emission end of the multimode optical fiber.
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18. An exposure system comprising a plurality of laser-light sources each of which is provided for exposure and includes:
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a heat-dissipation block made of copper or copper alloy;
a plurality of submounts which are made of a material having a thermal expansion coefficient of 3.5 to 6.0×
10−
6/°
C., have a thickness of 200 to 400 micrometers, and are separately formed on said heat-dissipation block;
a plurality of semiconductor lasers each of which is made of a nitride compound, has a single cavity and a form of a chip, and is mounted junction-side-down on one of said plurality of submounts;
a multimode optical fiber; and
an optical condenser system which collects laser beams emitted from said plurality of semiconductor lasers, and couples the collected laser beams to said multimode optical fiber;
wherein each of said plurality of semiconductor lasers and said plurality of submounts has a bonding surface, the bonding surface of each of the plurality of semiconductor lasers is bonded to the bonding surface of one of the plurality of submounts through a metalization layer and an Au—
Sn eutectic solder layer each of which is divided into a plurality of areas, and said multimode optical fiber in the plurality of laser-light sources is arranged to constitute a one-dimensional array at least at a light-emission end of the multimode optical fiber.
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19. An exposure system comprising a plurality of laser-light sources each of which is provided for exposure and includes:
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a heat-dissipation block made of copper or copper alloy;
a plurality of submounts which are made of a material having a thermal expansion coefficient of 3.5 to 6.0×
10−
6/°
C., have a thickness of 200 to 400 micrometers, and are separately formed on said heat-dissipation block;
a plurality of semiconductor lasers each of which is made of a nitride compound, has a single cavity and a form of a chip, and is mounted junction-side-down on one of said plurality of submounts;
a multimode optical fiber; and
an optical condenser system which collects laser beams emitted from said plurality of semiconductor lasers, and couples the collected laser beams to said multimode optical fiber;
wherein each of said plurality of semiconductor lasers and said plurality of submounts has a bonding surface, the bonding surface of each of the plurality of semiconductor lasers is bonded to the bonding surface of one of the plurality of submounts through a metalization layer and an Au—
Sn eutectic solder layer each of which is divided into a plurality of areas, and said multimode optical fiber in the plurality of laser-light sources is arranged to constitute a bundle at least at a light-emission end of the multimode optical fiber.
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Specification