Wafer bonding of thinned electronic materials and circuits to high performance substrates
First Claim
1. A method of bonding a wafer to a substrate comprising the steps of:
- providing a wafer having a front surface and a back surface;
attaching the front surface of the wafer to a support;
thinning the wafer from the back surface;
bonding the back surface of the wafer to a substrate using a thin bonding technique; and
removing the support from the front surface of the wafer.
1 Assignment
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Accused Products
Abstract
A method of bonding a wafer to a substrate comprising the steps of: providing a wafer having a front surface and a back surface; attaching the front surface of the wafer to a support; thinning the wafer from the back surface; bonding the back surface of the wafer to a substrate using a thin bonding technique; and removing the support from the front surface of the wafer. A circuit comprising: a substrate; and a wafer; wherein the wafer is at most about 50 microns thick; wherein the wafer has a front surface comprising features; and wherein the wafer has a back surface bonded to the substrate using a thin bonding technique.
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Citations
50 Claims
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1. A method of bonding a wafer to a substrate comprising the steps of:
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providing a wafer having a front surface and a back surface;
attaching the front surface of the wafer to a support;
thinning the wafer from the back surface;
bonding the back surface of the wafer to a substrate using a thin bonding technique; and
removing the support from the front surface of the wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A circuit comprising:
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a substrate; and
a wafer;
wherein the wafer has a front surface comprising features; and
wherein the wafer has a back surface bonded to the substrate using a thin bonding technique. - View Dependent Claims (30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50)
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Specification