Chip package sealing method
First Claim
Patent Images
1. A method of manufacturing a package, the method comprising:
- manufacturing a substrate to include at least one layer of LCP material;
manufacturing a cover made of LCP material to include a lower lip; and
sealing the cover to the substrate by heating the interface between the lower lip and the substrate.
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Abstract
A method of manufacturing a package including manufacturing a substrate to include at least one layer of LCP material, manufacturing a cover made of LCP material to include a lower lip, and sealing the cover to the substrate by heating the interface between the lower lip and the substrate.
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Citations
16 Claims
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1. A method of manufacturing a package, the method comprising:
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manufacturing a substrate to include at least one layer of LCP material;
manufacturing a cover made of LCP material to include a lower lip; and
sealing the cover to the substrate by heating the interface between the lower lip and the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of manufacturing a package, the method comprising:
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manufacturing a substrate;
manufacturing a cover to include a lower lip;
disposing a susceptor material between the lower lip of the cover and substrate; and
employing a laser to heat the interface between the lower lip and the substrate as laser energy is absorbed by the susceptor material.
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12. A method of manufacturing a package, the method comprising:
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manufacturing a substrate to include at least a top layer of pigmented material;
manufacturing a cover to include a lower lip;
mating the cover to the substrate; and
directing laser energy through the lower lip to be absorbed by the pigmentation in the substrate to seal the cover to the substrate.
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13. A method of manufacturing a package, the method comprising:
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manufacturing a substrate;
manufacturing a cover including pigmented material;
mating the cover to the substrate; and
directing laser energy through the substrate to be absorbed by the pigmented cover material to seal the cover to the substrate.
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14. A method of manufacturing a package, the method comprising:
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manufacturing a substrate;
manufacturing a cover to include a lower lip with at least one energy director extending therefrom;
mating the cover to the substrate; and
directing ultrasonic energy to be focused by the energy director to melt the interface between the cover and the substrate. - View Dependent Claims (15)
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16. A method of manufacturing a package, the method comprising:
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manufacturing a substrate to include a top layer including a cavity formed therein;
manufacturing a cover to include a lower lip with at least one said energy director extending therefrom;
mating the cover to the substrate so that the energy director is received in the cavity; and
directing ultrasonic energy to be focused by the energy director to melt the interface between the cover and the substrate.
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Specification