Chip package sealing method

• US 20040010910A1
• Filed: 06/13/2003
• Published: 01/22/2004
• Est. Priority Date: 06/19/2002
• Status: Active Grant

• Current Assignee: Foster-Miller Incorporated (Thermo Fisher Scientific Incorporated)
• Original Assignee: Foster-Miller Incorporated (Thermo Fisher Scientific Incorporated)
• Inventors: Farrell, Brian, Jaynes, Paul, Taylor, Malcolm
• Granted Patent: US 6,977,187 B2
• Time in Patent Office: Days
• US Class Current: 29/830
• CPC Class Codes: H01L 21/00 Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 23/02 Containers; Seals H01L23/12, H01L23/34, H01L23/48, H01L23/552, H01L23/66 take precedence; for memories G11C
• CPC Class Codes: H01L 23/04 characterised by the shape of the container or parts, e.g. caps, walls
• CPC Class Codes: H01L 23/06 characterised by the material of the container or its electrical properties
• CPC Class Codes: H01L 23/10 characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01077 Iridium [Ir]
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16153 Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
• CPC Class Codes: Y10T 29/49126 Assembling bases

Abstract

A method of manufacturing a package including manufacturing a substrate to include at least one layer of LCP material, manufacturing a cover made of LCP material to include a lower lip, and sealing the cover to the substrate by heating the interface between the lower lip and the substrate.

Claims

1. A method of manufacturing a package, the method comprising:

manufacturing a substrate to include at least one layer of LCP material;

manufacturing a cover made of LCP material to include a lower lip; and

sealing the cover to the substrate by heating the interface between the lower lip and the substrate.

2. The method of claim 1 further including disposing susceptor material between the lower lip of the cover and the substrate and wherein sealing includes employing a laser to heat the interface as laser energy is absorbed by the susceptor material.

3. The method of claim 2 in which the susceptor material is Clearweld™

.

4. The method of claim 1 in which the laser is an infrared laser.

5. The method of claim 1 further including adding pigmentation to at least the lower lip of the cover and sealing includes directing laser energy through the substrate to be absorbed by the lower lip.

6. The method of claim 1 further including adding pigmentation to the substrate and sealing includes directing laser energy through the lower lip to be absorbed by the substrate.

7. The method of claim 1 in which the lip includes at least one energy director extending therefrom and sealing includes directing ultrasonic energy to be focused by the energy director to melt the interface.

8. The method of claim 7 further including forming a cavity in the substrate which receives the energy director.

9. The method of claim 7 in which directing ultrasonic energy includes using a plunge welding ultrasonic welding system.

10. The method of claim 9 in which the plunge welding ultrasonic welding system includes a frame shaped horn which engages the lower lip.

11. A method of manufacturing a package, the method comprising:

manufacturing a substrate;

manufacturing a cover to include a lower lip;

disposing a susceptor material between the lower lip of the cover and substrate; and

employing a laser to heat the interface between the lower lip and the substrate as laser energy is absorbed by the susceptor material.

12. A method of manufacturing a package, the method comprising:

manufacturing a substrate to include at least a top layer of pigmented material;

manufacturing a cover to include a lower lip;

mating the cover to the substrate; and

directing laser energy through the lower lip to be absorbed by the pigmentation in the substrate to seal the cover to the substrate.

13. A method of manufacturing a package, the method comprising:

manufacturing a substrate;

manufacturing a cover including pigmented material;

mating the cover to the substrate; and

directing laser energy through the substrate to be absorbed by the pigmented cover material to seal the cover to the substrate.

14. A method of manufacturing a package, the method comprising:

manufacturing a substrate;

manufacturing a cover to include a lower lip with at least one energy director extending therefrom;

mating the cover to the substrate; and

directing ultrasonic energy to be focused by the energy director to melt the interface between the cover and the substrate.

15. The method of claim 14 further including forming a cavity in the substrate which receives the energy director.

16. A method of manufacturing a package, the method comprising:

manufacturing a substrate to include a top layer including a cavity formed therein;

manufacturing a cover to include a lower lip with at least one said energy director extending therefrom;

mating the cover to the substrate so that the energy director is received in the cavity; and

directing ultrasonic energy to be focused by the energy director to melt the interface between the cover and the substrate.