Modular coaxial electrical interconnect system and method of making the same

• US 20040014360A1
• Filed: 07/16/2002
• Published: 01/22/2004
• Est. Priority Date: 07/16/2002
• Status: Active Grant

• Current Assignee: Silicon Bandwidth Incorporated (Interplex Holdings Pte. Ltd.)
• Original Assignee: Silicon Bandwidth Incorporated (Interplex Holdings Pte. Ltd.)
• Inventors: Nickel, Josh, Crane, Stanford W. Jr., Jeon, Myoung-soo
• Granted Patent: US 6,905,367 B2
• Time in Patent Office: Days
• US Class Current: 439/608
• CPC Class Codes: H01R 12/727 Coupling devices presenting arrays of contacts
• CPC Class Codes: H01R 13/514 composed as a modular blocks or assembly, i.e. composed of co-operating parts provided with contact members or holding contact members between them
• CPC Class Codes: H01R 13/518 for holding or embracing several coupling parts, e.g. frames

Abstract

A modular connector assembly includes a modular frame having a first holes, second holes, and third holes formed at evenly spaced intervals. A plurality of modular interconnect components, fixable within the modular frame, have a back surface projection formed thereon. Each modular interconnect includes a contact housing made of electrically insulating material, an exterior of the contact housing comprising first and second side surfaces, a back surface, and a top surface. Contact signal pins are fixed within and electrically insulated from the contact housing.

Claims

1. A modular connector assembly comprising:

a modular frame comprising a first surface and a second surface connected at an angle to the first surface by a first angle region, the first surface, second surface, and first angle region having a plurality of first holes, plurality of second holes, and plurality of third holes, respectively, formed therethrough at evenly spaced intervals, and

a plurality of modular interconnect components fixable within the modular frame and including a back surface having a back surface projection formed thereon, each comprising;

a contact housing made of electrically insulating material, an exterior of the contact housing comprising first and second side surfaces, a back surface, and a top surface;

a plurality of contact signal pins fixed within and electrically insulated from the contact housing;

a plurality of side protrusions formed on the first side surface;

a plurality of side recesses formed in the second side surface;

at least one back surface peg formed on the back surface of the contact housing; and

top surface modular frame connection means on the top surface, wherein the top surface modular frame connection means is configured for receipt by the first holes, the back surface projection is configured for receipt by the second holes, the at least one back surface peg is configured for receipt by the third holes, and wherein side protrusions of the plurality of modular interconnect components are configured for receipt by side recesses of adjacent ones of the plurality of modular interconnect components.

2. The modular connector assembly according to claim 1, wherein an exterior surface of the is electrically conductive.

3. The modular connector assembly according to claim 1, wherein each of the plurality of modular interconnect components further comprises:

a plurality of shielding contacts disposed within and electrically coupled to the contact housing.

4. The modular connector assembly according to claim 1, wherein each of the plurality of modular interconnect components further comprises:

a component contact portion and a device contact portion integrally formed with the contact housing;

at least one contact opening formed within the component contact portion;

a plurality of pin openings formed in the device contact portion, each of the plurality of pin openings joining with the at least one contact opening, wherein

each of the plurality of contact signal pins comprises a component contact end and, opposing the component contact end, a device contact end, wherein a plurality of component contact ends are disposed within the at least one contact opening, and wherein a plurality of device contact portions are disposed within a single one of the plurality of pin openings,

wherein an active electronic device is electrically connectable to the plurality of device contact portions within the plurality of pin openings.

5. The modular connector assembly according to claim 4, wherein

pairs of the device contact portions are disposed within a single one of the plurality of pin openings.

6. The modular connector assembly according to claim 4, wherein:

the at least one contact opening comprises a plurality of contact openings; and

a plurality of the plurality of pin openings join with each of the plurality of contact openings.

7. The modular connector assembly according to claim 6, wherein each of the plurality of modular interconnect components further comprises:

an angle unit made of an electrically insulating material and a plurality of electrically conductive angle pins provided therein, wherein the plurality of the electrically conductive angle pins are bent at an angle and include first ends extending beyond the angle unit to be electrically connectable to the plurality of device contact portions within the pin openings, wherein the angle unit is interposed between the active electronic device and the plurality of device contact ends, and wherein the back surface projections are integrally formed on a back surface of the angle unit.

8. The modular connector assembly according to claim 7, wherein an exterior surface of the angle unit is electrically conductive.

9. The modular connector assembly according to claim 7, wherein:

the contact housing further comprises a notched slot structure integrally formed therein; and

the angle unit comprises a latching means integrally formed therewith, wherein the latching means of the angle unit, electrically connected to the plurality of device contact ends are fixed within the notched slot structure of the contact housing.

10. The modular connector assembly according to claim 8, wherein the exterior surface comprises:

a substantially flat bottom surface; and

a plurality of integrally formed ground bumps evenly spaced between second ends of the electrically conductive angle pins, wherein the second ends and the ground bumps protrude from the substantially flat bottom surface to be electrically contactable to the active electronic device.

11. The modular connector assembly according to claim 4, wherein:

the at least one contact opening comprises a single contact opening.

12. The modular connector assembly according to claim 11, wherein the modular frame further comprises a third surface connected at an angle to the second surface by a second angle region, the third surface and the second angle region having a plurality of fourth holes, and a plurality of fifth holes, respectively, formed therethrough at evenly spaced intervals.

13. The modular connector assembly according to claim 11, wherein the back surface of the contact housing comprises the back surface projection.

14. The modular connector assembly according to claim 12, wherein the contact housing further comprises:

a bottom surface; and

bottom surface modular frame connection means on the bottom surface, wherein the bottom surface modular frame connection means is configured for receipt by the fourth holes, and wherein the at least one back surface peg is additionally configured for receipt by the fifth holes.

15. The modular connector assembly according to claim 13, wherein the device contact portions extend beyond the back surface projection.

16. The modular connector assembly according to claim 15, wherein the back surface projection further comprises electrically conductive ground bumps integrally formed therewith, the ground bumps evenly spaced between the device contact portions.