Die-attaching paste and semiconductor device

• US 20040014842A1
• Filed: 04/01/2003
• Published: 01/22/2004
• Est. Priority Date: 10/11/2000
• Status: Abandoned Application

• Current Assignee: Sumitomo Bakelite Company Limited
• Original Assignee: Sumitomo Bakelite Company Limited
• Inventors: Kagimoto, Tomohiro, Onami, Kazuto, Takeda, Toshiro
• Application Number:
  US10/398,012
• Publication Number:
  US 20040014842A1
• Time in Patent Office: Days
• US Class Current: 523/400
• CPC Class Codes: C08G 59/3227 Compounds containing acyclic nitrogen atoms
• CPC Class Codes: C08K 3/08 Metals
• CPC Class Codes: C08K 3/36 Silica
• CPC Class Codes: C08L 63/00 Compositions of epoxy resins; Compositions of derivatives of epoxy resins
• CPC Class Codes: H01L 2224/29 of an individual layer connector
• CPC Class Codes: H01L 2224/29099 Material
• CPC Class Codes: H01L 2224/29101 the principal constituent melting at a temperature of less than 400°C
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29199 Material of the matrix
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/29298 Fillers
• CPC Class Codes: H01L 2224/29299 Base material
• CPC Class Codes: H01L 2224/29339 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/29386 with a principal constituent of the material being a non metallic, non metalloid inorganic material
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/8319 Arrangement of the layer connectors prior to mounting
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 23/49513 having bonding material between chip and die pad
• CPC Class Codes: H01L 24/29 of an individual layer connector
• CPC Class Codes: H01L 24/31 Structure, shape, material or disposition of the layer connectors after the connecting process
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01026 : Iron [Fe]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01061 : Promethium [Pm]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/05442 : SiO2
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/3512 : Cracking

Abstract

The present invention provides a resin paste which has a sufficient hot adhesion strength and gives a cured product of low elastic modulus, and thereby, causes no chip cracking or warpage and resultantly no property deterioration of IC or the like even when used for bonding of a large chip (e.g. IC) to copper frame or the like, and which is rapidly-curable, and generates no void. That is, the present invention lies in a die-attaching paste comprising, as essential components:

(A) a liquid epoxy resin comprising (a1) an epoxy resin containing chlorine in an amount of 500 ppm or less and having a viscosity of 5,000 mPa·s or less at 25° C. and (a2) an epoxy group-containing reactive diluent containing chlorine in an amount of 300 ppm or less and having a viscosity of 1,000 mPa·s or less at 25° C., the weight ratio of (a1):(a2) being 40:60 to 90:10,

(B) a phenol compound having at least two hydroxyl groups in the molecule,

(C) a latent curing agent,

(D) an imidazole compound, and

(E) an inorganic filler.

The present invention also lies in a semiconductor device produced by using the above die-attaching paste.

Claims

1. A die-attaching paste comprising, as essential components:

(A) a liquid epoxy resin comprising (a1) an epoxy resin represented by the following general formula (1), containing chlorine in an amount of 500 ppm or less and having a viscosity of 5,000 mPa·

s or less at 25°

C.;

wherein R is an alkyl group having 1 to 3 carbon atoms or —

H, and (a2) an epoxy group-containing reactive diluent containing chlorine in an amount of 300 ppm or less and having a viscosity of 1,000 mPa·

s or less at 25°

C., the weight ratio of (a1);

(a2) being 40;

60 to 90;

10,

(B) a phenol compound having at least two hydroxyl groups in the molecule,

(C) a latent curing agent,

(D) an imidazole compound, and

(E) an inorganic filler,

wherein the amounts of the components (B), (C) and (D) are 1 to 10 parts by weight, 0.5 to 5 parts by weight and 0.5 to 10 parts by weight, respectively, per 100 parts by weight of the component (A), and the amount of the component (E) is 25 to 900 parts by weight per 100 parts by weight of the total of the components (A), (B), (C) and (D).

2. A semiconductor device produced by using a die-attaching paste set forth in claim 1.