Method and apparatus for reducing heat flow

• US 20040015198A1
• Filed: 07/18/2002
• Published: 01/22/2004
• Est. Priority Date: 07/18/2002
• Status: Abandoned Application

• Current Assignee: Medtronic Incorporated (Medtronic Plc)
• Original Assignee: Medtronic Incorporated (Medtronic Plc)
• Inventors: Casby, Kurt J., Skarstad, Paul M.
• Application Number:
  US10/198,016
• Publication Number:
  US 20040015198A1
• Time in Patent Office: Days
• US Class Current: 607/36
• CPC Class Codes: A61N 1/378 Electrical supply

Abstract

The present invention provides a method and apparatus for reducing heat flow in sealed devices. The apparatus includes a casing adapted to enclose a volume. The apparatus further includes at least one sacrificial member positioned in the casing, wherein the at least one sacrificial member is adapted to absorb at least a portion of a heat flow in the volume.

Claims

1. An apparatus, comprising:

a casing adapted to enclose a volume; and

at least one sacrificial member positioned in the casing, wherein the at least one sacrificial member is adapted to absorb at least a portion of a heat flow in the volume.

2. The apparatus of claim 1, wherein the at least one sacrificial member is adapted to absorb at least a portion of the heat flow by at least partially melting at least a portion of the sacrificial member.

3. The apparatus of claim 2, wherein the casing includes a cover adapted to form a seal with a case that substantially encloses the volume.

4. The apparatus of claim 3, wherein the casing is adapted to be hermetically sealed by the application of heat.

5. The apparatus of claim 4, wherein the sacrificial member is positioned substantially between the seal and the volume.

6. The apparatus of claim 5, wherein the casing is adapted to be implanted in a human body.

7. The apparatus of claim 6, wherein the volume substantially encloses at least one electronic component.

8. The apparatus of claim 1, further comprising at least one supporting member adapted to support the at least one sacrificial member, wherein the supporting member is adapted to reflect heat.

9. The apparatus of claim 8, wherein the at least one supporting member encloses the at least one sacrificial member.

10. The apparatus of claim 1, wherein the sacrificial member is formed of at least one of a crystalline material, a polymer, and a crystalline impregnated fabric.

11. The apparatus of claim 1, wherein the sacrificial member comprises at least one conductive member.

12. The apparatus of claim 11, wherein the conductive member is formed of at least one of carbon fiber and metal struts.

13. An apparatus, comprising:

a casing;

a cover adapted to form a seal with the casing using heat; and

at least one sacrificial member positioned in the casing, wherein the sacrificial member is adapted to absorb at least a portion of a heat flow by at least partially melting at least a portion of the sacrificial member.

14. The apparatus of claim 13, wherein the sacrificial member is adapted to reduce the heat flow from the seal to the volume.

15. The apparatus of claim 14, wherein the seal includes a hermetic seal.

16. The apparatus of claim 15, wherein the casing is adapted to be implanted in a human.

17. The apparatus of claim 16, wherein the volume substantially encloses at least one electronic component.

18. The apparatus of claim 17, wherein the at least one electronic component is a battery.

19. The apparatus of claim 18, wherein the at least one electronic component is a capacitor.

20. The apparatus of claim 13, further comprising at least one supporting member adapted to support the at least one sacrificial member, wherein the at least one supporting member is adapted to reflect heat.

21. The apparatus of claim 20, wherein the at least one supporting member encloses the at least one sacrificial member.

22. A method, comprising:

applying heat to substantially seal a casing; and

positioning a sacrificial member in the casing, wherein the sacrificial member is adapted to absorb at least a portion of said heat.

23. The method of claim 22, wherein absorbing at least a portion of said heat comprises at least partially melting at least a portion of the sacrificial member.

24. The method of claim 23, wherein substantially sealing the casing comprises substantially sealing an edge of a cover in alignment with an edge of the casing.

25. The method of claim 24, wherein positioning the sacrificial member further comprises positioning the sacrificial member substantially between the cover and the casing.

26. The method of claim 22, further comprising supporting the at least one sacrificial member with at least one supporting member being adapted to reflect heat.

27. The method of claim 26, wherein supporting the sacrificial member further comprises enclosing the sacrificial member in the supporting member.

28. The method of claim 23, wherein sealing the casing further comprises hermetically sealing the casing.

29. The method of claim 23, further comprising forming the at least one sacrificial member with at least one conductive member being adapted to conduct heat through the sacrificial member.

30. A method, comprising:

providing a casing to enclose at least one electronic component; and

providing at least one of a heat absorber, a heat conductor, and a heat insulator, wherein the at least one of a heat absorber, a heat conductor, and a heat insulator is adapted to reduce the flow of heat in the casing by at least partially melting at least a portion of the heat absorber.

31. The method of claim 30, wherein providing the casing comprises sealing an edge of a cover to an edge of the casing substantially enclosing the electronic component.

32. The method of claim 31, wherein sealing comprises hermetically sealing the edge of the cover to the edge of the casing.

33. The method of claim 32, further comprising adapting the casing to be implanted in a living being.

34. An apparatus, comprising:

a sealed casing enclosing at least one electronic component; and

a partially melted sacrificial material positioned in the sealed casing, wherein the partially melted sacrificial member is capable of absorbing a portion of heat.

35. The apparatus of claim 34, wherein the electronic component is a battery.

36. The apparatus of claim 34, wherein the electronic component is a capacitor.

37. The apparatus of claim 34, wherein the sacrificial member further comprises a refractory supporting member.

38. The apparatus of claim 34, wherein the sacrificial member comprises branched content formed of olefin.