Implantable medical device incorporating miniaturized circuit module
First Claim
1. An implantable medical device operable to perform a therapeutic and/or monitoring function comprising:
- a housing having a housing side wall and inner and outer wall surfaces of a predetermined contour enclosing a hermetically sealed chamber; and
a battery enclosed within said hermetically sealed chamber;
an electronic circuit module powered by the battery comprising a plurality of discrete components and at least one integrated circuit IC chip mounted to a circuit board having a volumetric form factor dimensioned to fit within said hermetically sealed chamber along with said battery, said electronic circuit module comprising at least one IC inductor formed integrally with said IC chip thereby reducing the form factor of the electronic circuit module.
1 Assignment
0 Petitions
Accused Products
Abstract
Implantable medical devices (IMDs) having RF telemetry capabilities for uplink transmitting patient data and downlink receiving programming commands to and from an external programmer having an improved RF module configured to occupy small spaces within the IMD housing to further effect the miniaturization thereof An RF module formed of an RF module substrate and at least one IC chip and discrete components has a volume and dimensions that are optimally minimized to reduce its volumetric form factor. Miniaturization techniques include: (1) integrating inductors into one or more IC chips mounted to the RF module substrate; (2) mounting each IC chip into a well of the RF module substrate and using short bonding wires to electrically connect bond pads of the RF module substrate and the IC chip; and (3) surface mounting discrete capacitors over IC chips to reduce space taken up on the RF module substrate. The integrated inductors are preferably fabricated as planar spiral wound conductive traces formed of high conductive metals to reduce trace height and width while maintaining low resistance, thereby reducing parasitic capacitances between adjacent trace side walls and with a ground plane of the IC chip. The spiral winding preferably is square or rectangular, but having truncated turns to eliminate 90° angles that cause point-to-point parasitic capacitances. The planar spiral wound conductive traces are further preferably suspended over the ground plane of the RF module substrate by micromachining underlying substrate material away to thereby reduce parasitic capacitances.
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Citations
25 Claims
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1. An implantable medical device operable to perform a therapeutic and/or monitoring function comprising:
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a housing having a housing side wall and inner and outer wall surfaces of a predetermined contour enclosing a hermetically sealed chamber; and
a battery enclosed within said hermetically sealed chamber;
an electronic circuit module powered by the battery comprising a plurality of discrete components and at least one integrated circuit IC chip mounted to a circuit board having a volumetric form factor dimensioned to fit within said hermetically sealed chamber along with said battery, said electronic circuit module comprising at least one IC inductor formed integrally with said IC chip thereby reducing the form factor of the electronic circuit module. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 11, 12, 13)
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- 9. The implantable medical device of Claim I, wherein the IC chip substrate further comprises a ground plane, and the IC inductor is formed of a planar spiral formed of a continuous conductive trace extending between bonding pads that is suspended above and spaced from said ground plane formed by micromachining substrate material between the exposed surface of the suspended planar spiral and the ground plane away, to thereby reduce parasitic capacitances between adjacent turns of the trace and through the IC chip substrate to the ground plane.
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15. An implantable medical device operable to perform a therapeutic and/or monitoring function comprising:
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a housing having a housing side wall and inner and outer wall surfaces of a predetermined contour enclosing a hermetically sealed chamber;
a battery enclosed within said hermetically sealed chamber; and
an electronic module powered by said battery having a volumetric form factor dimensioned to fit within said hermetically sealed chamber along with said battery, said electronic module comprising a module substrate board, a plurality of discrete components and at least one integrated circuit IC chip;
said module substrate having a predetermined module substrate thickness with a well formed in said module substrate extending from a module substrate surface through at least a portion of said module substrate thickness, and at least one module bonding pad formed on the electronic module substrate surface, said IC chip having a predetermined IC chip substrate thickness, at least one IC bonding pad formed on an exposed IC chip surface, and said IC chip mounted within said well of said electronic module substrate thereby reducing the form factor of the electronic module, and a conductor extending between said module bonding pad and said IC bonding pad. - View Dependent Claims (16, 17, 18, 19, 20)
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21. An implantable medical device operable to perform a therapeutic and/or monitoring function comprising:
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a housing having a housing side wall and inner and outer wall surfaces of a predetermined contour enclosing a hermetically sealed chamber;
a battery enclosed within said hermetically sealed chamber; and
an electronic module powered by said battery having a volumetric form factor dimensioned to fit within said hermetically sealed chamber along with said battery, said electronic module comprising a module substrate board, and at least one discrete component and at least one integrated circuit IC chip are mounted to said electronic module, and wherein at least one discrete capacitor is mounted to said exposed IC chip surface thereby reducing the form factor of the electronic module. - View Dependent Claims (22, 23, 24, 25)
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Specification