Intelligent binning for electrically repairable semiconductor chips
First Claim
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1. A system for determining a repairable semiconductor device of a plurality of semiconductor devices comprising:
- testing apparatus for performing a test of a first type on a semiconductor device for identifying types of failures in the semiconductor device, the testing apparatus including a support for supporting a semiconductor device under test of said plurality of semiconductor devices;
processing circuitry for communicating with the testing apparatus for determining a type of failure of a number of the identified types of failures, the processing circuitry providing at least one signal indicative of the at least one type of failure; and
decision circuitry for receiving the at least one signal indicative of the at least one type of failure of the types of failures for considering the at least one type of failure of the identified types of failures in one of for designating the at least one semiconductor device for an additional procedure, for designating the at least one semiconductor device for repair, and for designating the at least one semiconductor device for additional tests of the first type, the decision circuitry for designating the at least one semiconductor device for the additional procedure when the at least one type of failure of the identified types of failures is within a first number set, designating the at least one semiconductor device for repair if the number of the identified types of failures is within a second number set, and determining when the at least one semiconductor device is repairable.
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Abstract
The present invention relates to a system and method for testing one or more semiconductor devices (e.g., packaged chips). Test equipment performs at least tests of a first type on the semiconductor device and identifies failures in the semiconductor device, if any. A number of failures are determined. In the case where there are some failures, decision circuitry determines whether it is more efficient to repeat the tests or repair the semiconductor device, if it is repairable.
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22 Claims
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1. A system for determining a repairable semiconductor device of a plurality of semiconductor devices comprising:
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testing apparatus for performing a test of a first type on a semiconductor device for identifying types of failures in the semiconductor device, the testing apparatus including a support for supporting a semiconductor device under test of said plurality of semiconductor devices;
processing circuitry for communicating with the testing apparatus for determining a type of failure of a number of the identified types of failures, the processing circuitry providing at least one signal indicative of the at least one type of failure; and
decision circuitry for receiving the at least one signal indicative of the at least one type of failure of the types of failures for considering the at least one type of failure of the identified types of failures in one of for designating the at least one semiconductor device for an additional procedure, for designating the at least one semiconductor device for repair, and for designating the at least one semiconductor device for additional tests of the first type, the decision circuitry for designating the at least one semiconductor device for the additional procedure when the at least one type of failure of the identified types of failures is within a first number set, designating the at least one semiconductor device for repair if the number of the identified types of failures is within a second number set, and determining when the at least one semiconductor device is repairable. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification