Method of manufacturing a device, device, non-contact type card medium, and electronic equipment

• US 20040016115A1
• Filed: 04/22/2003
• Published: 01/29/2004
• Est. Priority Date: 04/22/2002
• Status: Active Grant

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Hashimoto, Takashi
• Granted Patent: US 7,131,194 B2
• Time in Patent Office: Days
• US Class Current: 29/842
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 2201/0195 Dielectric or adhesive layers comprising a plurality of layers, e.g. in a multilayer structure
• CPC Class Codes: H05K 2201/0352 Differences between the conductors of different layers of a multilayer
• CPC Class Codes: H05K 2201/09509 Blind vias, i.e. vias having one side closed
• CPC Class Codes: H05K 2201/09981 Metallised walls
• CPC Class Codes: H05K 2203/013 Inkjet printing, e.g. for printing insulating material or resist using ink-jet printing to form a conductive pattern H05K3/125
• CPC Class Codes: H05K 2203/0534 Offset printing, i.e. transfer of a pattern from a carrier onto the substrate by using an intermediate member
• CPC Class Codes: H05K 2203/061 of previously made multilayered subassemblies laminating only or mainly similar single-sided circuit boards H05K3/4617; laminating only or mainly similar double-sided circuit boards H05K3/462
• CPC Class Codes: H05K 2203/063 of preperforated insulating layer
• CPC Class Codes: H05K 2203/1173 Differences in wettability, e.g. hydrophilic or hydrophobic areas
• CPC Class Codes: H05K 3/125 by ink-jet printing
• CPC Class Codes: H05K 3/1275 by other printing techniques, e.g. letterpress printing, intaglio printing, lithographic printing, offset printing
• CPC Class Codes: H05K 3/207 using a prefabricated paste pattern, ink pattern or powder pattern
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive
• CPC Class Codes: H05K 3/4069 for via connections in organic insulating substrates
• CPC Class Codes: H05K 3/4614 the electrical connections between the circuit boards being made during lamination
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49073 by assembling coil and core
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/49147 : Assembling terminal to base
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/49162 : by using wire as conductive path
• CPC Class Codes: Y10T 29/49169 : Assembling electrical component directly to terminal or elongated conductor
• CPC Class Codes: Y10T 29/49224 : with coating

Abstract

Wirings 2B1 are formed by application of heat treatment after an ink jet system is used to discharge a conductive liquid L onto a provisional substrate 5 having a predetermined repellent property, bonding an insulating layer 4B1 to the wirings 2B1 with an adhesive material 3B1 therebetween, peeling and removing the provisional substrate 5, and bonding and fixing the wirings 2B1 together with the insulating film 4B1 to a main substrate 1 by an adhesive material 3B1.

Claims

1. A method of manufacturing a device, comprising the steps of:

(a) forming first wirings on a provisional substrate;

(b) mounting an insulating body on the first wirings to form a laminated body of the first wirings and the insulating body;

(c) peeling off the laminated body from the provisional substrate; and

(d) mounting the laminated body on a main substrate.

2. The method of manufacturing a device, according to claim 1, wherein in the step (a), before the first wirings are formed, a surface of the provisional substrate is made to possess a property permitting the first wirings and the provisional substrate to peel off in the step (c).

3. The method of manufacturing a device, according to claim 2, wherein the property permitting the first wirings and the provisional substrate to peel off comprises a repellent property.

4. The method of manufacturing a device, according to claim 1, wherein in the step (a), the first wirings are formed by means of a droplet discharge method.

5. The method of manufacturing a device, according to claim 1, wherein the step (b) comprises bonding an insulating film to the first wirings.

6. The method of manufacturing a device, according to claim 1, wherein in the step (d),

second wirings are first formed on the main substrate, and

the laminated body is mounted on the main substrate in a manner to provide conduction between the second wirings and the first wirings.

7. The method of manufacturing a device, according to claim 1, wherein in the step (d),

circuit terminals are first formed on the main substrate, and

the laminated body is mounted on the main substrate in a manner to provide conduction between the circuit terminals and the first wirings.

8. The method of manufacturing a device, according to claim 1, wherein openings are formed in the insulating body to expose at least a part of the first wirings.

9. The method of manufacturing a device, according to claim 8, wherein the openings are first formed on the insulating body prior to the step (b).

10. The method of manufacturing a device, according to claim 8, further comprising, after the step (d),

(e) forming a conductive layer in the openings.

11. The method of manufacturing a device, according to claim 10, wherein the step (e) further comprises a droplet discharge method.

12. The method of manufacturing a device, according to claim 11, wherein the droplets comprise liquid bodies containing fine metallic particles.

13. The method of manufacturing a device, according to claim 1, wherein multilayer wirings are formed by forming at least one or more new laminated bodies on the laminated body which is performed in the same step as that in which the laminated body is formed.

14. A device manufactured by the manufacturing method according to claim 1.

15. A non-contact type card medium comprising an antenna circuit manufactured by the manufacturing method according to claim 1.

16. Electronic equipment comprising a device according to claim 14.