Method and resulting device for fabricating electret materials on bulk substrates
First Claim
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1. A method of fabricating an electret device, the method comprising:
- providing a thickness of substrate material having a contact region;
forming an electrically floating conducting region formed overlying the thickness of substrate material, the floating conducting region being free from physical contact with the contact region;
forming a protective layer formed overlying the floating conductive layer, the protective layer having a surface region, the protective layer sealing the floating conducting region;
whereupon the thickness of substrate material, floating conducting region, and protective layer form a sandwiched structure having an initial charge density of at least 1×
10−
4 Coulombs/m2 and a peak to peak charge uniformity of 5% and less.
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Abstract
An electret device. The device has a thickness of substrate material having a contact region. An electrically floating conducting region is formed overlying the thickness of substrate material. The floating conducting region is free from physical contact with the contact region. A protective layer is formed overlying the floating conductive layer. The protective layer has a surface region and seals the floating conducting region. The thickness of substrate material, floating conducting region, and protective layer form a sandwiched structure having a charge density of at least 1×10−4 Coulombs/m2 and a peak to peak charge uniformity of 5% and less.
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Citations
43 Claims
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1. A method of fabricating an electret device, the method comprising:
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providing a thickness of substrate material having a contact region;
forming an electrically floating conducting region formed overlying the thickness of substrate material, the floating conducting region being free from physical contact with the contact region;
forming a protective layer formed overlying the floating conductive layer, the protective layer having a surface region, the protective layer sealing the floating conducting region;
whereupon the thickness of substrate material, floating conducting region, and protective layer form a sandwiched structure having an initial charge density of at least 1×
10−
4 Coulombs/m2 and a peak to peak charge uniformity of 5% and less. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. An electret device comprising:
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a thickness of substrate material having a contact region;
a floating conducting region formed overlying the thickness of substrate material, the floating conducting region being free from physical contact with the contact region;
a protective layer formed overlying the floating conductive layer, the protective layer having a surface region, the surface region being free from physical contact with the floating conducting region;
whereupon the thickness of substrate material, floating conducting region, and protective layer form a sandwiched structure having a charge density of at least 1×
10−
4 Coulombs/m2 and a peak to peak charge uniformity of 5% and less. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43)
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Specification