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Plasma etching apparatus and plasma etching method

  • US 20040016508A1
  • Filed: 07/11/2003
  • Published: 01/29/2004
  • Est. Priority Date: 03/16/1995
  • Status: Abandoned Application
First Claim
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1. A plasma processing apparatus comprising:

  • a plasma generating unit;

    a process chamber capable of having an inside pressure thereof reduced;

    a process gas supply unit for supplying gas to said process chamber;

    a specimen table for holding a specimen; and

    a vacuum pumping unit; and

    a monitor unit;

    wherein said process chamber includes an outer cylinder having the capability of withstanding a reduced pressure, and an inner cylinder arranged inside said outer cylinder; and

    wherein said monitor unit enables monitoring of a temperature of said inner cylinder at least one of continuously and optionally at a time of processing of a specimen.

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