Multi-chemistry plating system
First Claim
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1. An electrochemical plating system, comprising:
- a substrate loading station positioned in communication with a mainframe processing platform;
at least one substrate plating cell positioned on the mainframe;
at least one substrate bevel cleaning cell positioned on the mainframe; and
a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a substrate heating plate and a substrate cooling plate adjacently positioned therein.
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Abstract
Embodiments of the invention generally provide an electrochemical plating system. The plating system includes a substrate loading station positioned in communication with a mainframe processing platform, at least one substrate plating cell positioned on the mainframe, at least one substrate bevel cleaning cell positioned on the mainframe, and a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a heating plate, a cooling plate, and a substrate transfer robot therein.
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Citations
32 Claims
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1. An electrochemical plating system, comprising:
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a substrate loading station positioned in communication with a mainframe processing platform;
at least one substrate plating cell positioned on the mainframe;
at least one substrate bevel cleaning cell positioned on the mainframe; and
a stacked substrate annealing station positioned in communication with at least one of the mainframe and the loading station, each chamber in the stacked substrate annealing station having a substrate heating plate and a substrate cooling plate adjacently positioned therein. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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13. A multi-chemistry plating system, comprising:
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a plurality of plating cells positioned on a common platform;
a cleaning cell positioned on the platform;
an annealing chamber positioned in communication with the platform; and
a multi-chemistry fluid delivery system positioned in communication with the platform and in fluid communication with the plurality of plating cells, the fluid delivery system being configured to mix and distribute a plurality of fluid solutions to each of the plurality of plating cells. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. An electrochemical plating system, comprising:
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a central mainframe having a substrate transfer robot positioned thereon;
means for mixing multiple plating chemistries in communication with the mainframe;
a plurality of electrochemical plating cells positioned on the mainframe;
means for delivering multiple chemical solutions to each of the plurality of electrochemical plating cells, the means for delivering being in fluid communication with the means for mixing;
means for removing unwanted deposits from a bevel of a substrate;
means for rinsing and drying the substrate; and
means for annealing the substrate. - View Dependent Claims (27, 28)
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29. An electrochemical plating system, comprising:
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an electrochemical plating cell positioned on a processing platform, the electrochemical plating cell comprising;
a cell body configured to contain a plating solution and having an overflow weir positioned thereon;
an anode positioned in the cell body;
an ionic membrane positioned across the cell body at a position above the anode and below the overflow weir, the ionic membrane separating an anolyte compartment below the membrane from a catholyte compartment above the membrane; and
a porous diffusion member positioned in the cell body above the membrane and below the overflow weir;
a substrate cleaning cell positioned on the processing platform; and
a stacked substrate annealing station positioned in communication with the processing platform. - View Dependent Claims (30, 31, 32)
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Specification