Wiring structure

• US 20040017279A1
• Filed: 01/24/2003
• Published: 01/29/2004
• Est. Priority Date: 07/26/2002
• Status: Abandoned Application

• Current Assignee: Renesas Technology Corporation (Renesas Electronics Corporation), Ryoden Semiconductor System Engineering Corporation
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation), Ryoden Semiconductor System Engineering Corporation
• Inventors: Sunada, Shigeki, Kamoshima, Takao, Izumitani, Junko
• Application Number:
  US10/349,964
• Publication Number:
  US 20040017279A1
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05026 the internal layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05166 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/05572 the external layer extending out of an opening
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05666 Titanium [Ti] as principal constituent
• CPC Class Codes: H01L 2224/13 of an individual bump connector
• CPC Class Codes: H01L 23/5258 the change of state resulting from the use of an external beam, e.g. laser beam or ion beam
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

The present invention protects a wiring against an etchant when a fuse connected to this wiring is subjected to a laser blow. A fuse has a barrier metal at its lower side. A plug is connected to the lower side of the fuse. The plug has a barrier metal at least at its lower side. Even if the fuse is partly removed through the laser blow at a region other than a portion where the fuse is connected to the plug, two layers of the barrier metals remain between the removed portion and a lower wiring. This enlarges the margin for preventing the adverse influence, such as corrosion and breaking of the lower wiring, brought by an etchant associated in other manufacturing process.

Claims

1. A wiring structure comprising:

a first wiring;

a second wiring provided at a higher side than said first wiring; and

a joint intervening between said first wiring and said second wiring configured to connect said first wiring with said second wiring, wherein

said second wiring comprises a main portion and a barrier metal covering a lower end of said main portion, and

one of said first wiring and said second wiring serves as a fuse removable when subjected to a laser blow at a region other than a portion where said one of said first wiring and said second wiring is connected to said joint.

2. The wiring structure according to claim 1, wherein said joint is configured as a plug.

3. The wiring structure according to claim 2, wherein a hole defining said plug has a diameter larger than twice a product of a side coverage and a film thickness of said barrier metal.

4. The wiring structure according to claim 2, wherein said second wiring serves as said fuse.

5. The wiring structure according to claim 2, wherein said first wiring serves as said fuse.

6. The wiring structure according to claim 1, wherein said joint is provided as a third wiring.

7. The wiring structure according to claim 6, wherein said second wiring serves as said fuse.

8. The wiring structure according to claim 6, wherein said first wiring serves as said fuse.

9. The wiring structure according to claim 1, wherein said joint is made of the barrier metal.

10. The wiring structure according to claim 9, wherein said joint is configured so as to constitute at least one plug.

11. The wiring structure according to claim 10, wherein a hole defining said plug has a diameter smaller than twice a product of a side coverage and a film thickness of said barrier metal.

12. The wiring structure according to claim 10, wherein said joint is configured as a plurality of plugs.

13. The wiring structure according to claim 12, wherein said second wiring serves as said fuse.

14. The wiring structure according to claim 12, wherein said first wiring serves as said fuse.

15. The wiring structure according to claim 10, wherein said joint is constituted by said barrier metal of said second wiring.

16. The wiring structure according to claim 15, wherein said second wiring serves as said fuse.

17. The wiring structure according to claim 15, wherein said first wiring serves as said fuse.

18. A wiring structure comprising:

a first wiring;

a second wiring provided at a higher side than said first wiring, said second wiring being connected to said first wiring, wherein

said first wiring comprises a main portion and an anti-reflection film covering an upper end of said main portion,

said second wiring comprising a main portion and a barrier metal covering a lower end of said main portion of the second wiring, and

said first wiring serves as a fuse removable when subjected to a laser blow at a region other than a portion where said first wiring is connected to said second wiring.

19. A wiring structure comprising:

a fuse which is embedded in an insulator and is connected to a wiring, and is partly removed at a region other than a portion where said fuse is connected to said wiring, and

a coating layer covering an exposed surface of the partly removed fuse.

20. The wiring structure according to claim 19, wherein said coating layer is a denatured layer obtained by denaturing said exposed surface of the partly removed fuse.