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Methods for fabricating three dimensional integrated circuits

  • US 20040018711A1
  • Filed: 10/08/2002
  • Published: 01/29/2004
  • Est. Priority Date: 07/08/2002
  • Status: Abandoned Application
First Claim
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1. A method of forming a semiconductor device, comprising:

  • fabricating one or more digital circuits on a substrate;

    selectively fabricating either a memory circuit or a conductive pattern substantially above the digital circuits to control portion of digital circuits; and

    fabricating an interconnect and routing layer substantially above the digital circuits and memory circuits to connect digital circuits and one of the memory circuit or the conductive pattern.

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