Method and apparatus for high volume assembly of radio frequency identification tags
First Claim
Patent Images
1. A method for assembling a plurality of radio frequency identification (RFID) tags, comprising:
- (a) transferring a plurality of dies from a support surface to a chip carrier that has a plurality of cells accessible on a first surface of the chip carrier so that each die of the plurality of dies resides in a corresponding cell of the plurality of cells and is recessed in the corresponding cell with respect to the first surface; and
(b) applying an underfill material into each cell of the plurality of cells to substantially cover each die in the corresponding cell.
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Abstract
An RFID tag that includes a die having one or more connecting pads is assembled. A plurality of dies separated die from a wafer are attached to a support surface. The plurality of dies is transferred from the support surface to a substrate structure that includes a plurality of tag substrates.
94 Citations
60 Claims
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1. A method for assembling a plurality of radio frequency identification (RFID) tags, comprising:
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(a) transferring a plurality of dies from a support surface to a chip carrier that has a plurality of cells accessible on a first surface of the chip carrier so that each die of the plurality of dies resides in a corresponding cell of the plurality of cells and is recessed in the corresponding cell with respect to the first surface; and
(b) applying an underfill material into each cell of the plurality of cells to substantially cover each die in the corresponding cell. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
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34. A method for assembling a plurality of radio frequency identification (RFID) tags, comprising:
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(a) positioning a support surface closely adjacent to a surface of a punch tape, such that each die of a plurality of dies attached to a first surface of the support surface is closely adjacent to a corresponding empty cell of a plurality of empty cells in the surface of the punch tape; and
(b) simultaneously transferring each die of the plurality of dies into the closely adjacent corresponding empty cell from the support surface. - View Dependent Claims (35, 36, 37, 38, 39, 40)
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41. A method for assembling a plurality of radio frequency identification (RFID) tags, comprising:
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(a) positioning a first surface of a support surface to contact a first surface of substantially each die attached to a second support surface to cause the first surface of substantially each die attached to the second support become attached to the first surface of the first support surface;
(b) increasing a distance between the first support surface and second support surface to cause substantially each die to become detached from the second support surface;
(c) positioning the first support surface closely adjacent to a surface of a punch tape, such that a second surface of each die of a plurality of dies attached to the first surface of the first support surface is closely adjacent to a corresponding empty cell of a plurality of empty cells in the surface of the punch tape; and
(d) simultaneously transferring each die of the plurality of dies into the closely adjacent corresponding empty cell from the first support surface. - View Dependent Claims (42, 43, 44, 45)
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46. A method for assembling a plurality of radio frequency identification (RFID) tags, comprising:
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(a) applying an underfill material on a surface of a substrate structure having a plurality of tag substrate portions;
(b) positioning a support surface closely adjacent to the surface of the substrate structure, such that each die of a plurality of dies attached to a first surface of the support surface is closely adjacent to a corresponding tag substrate of the plurality of tag substrate portions; and
(c) simultaneously transferring each die of the plurality of dies onto the closely adjacent corresponding tag substrate from the support surface. - View Dependent Claims (47, 48, 49, 50)
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51. A system for assembling a plurality of radio frequency identification (RFID) tags, comprising:
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means for transferring a plurality of dies from a support surface to a chip carrier, wherein the chip carrier has a plurality of cells accessible on a first surface, wherein each die of the plurality of dies is transferred to reside in a corresponding cell of the plurality of cells and is recessed in the corresponding cell with respect to the first surface; and
means for applying an underfill material into each cell of the plurality of cells to substantially cover each die in the corresponding cell. - View Dependent Claims (52, 53, 54, 55, 56, 57, 58, 59, 60)
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Specification