Method and system for forming a die frame for transferring dies therewith

• US 20040020040A1
• Filed: 05/06/2003
• Published: 02/05/2004
• Est. Priority Date: 08/02/2002
• Status: Active Grant

• Current Assignee: Symbol Technologies, Inc. (Zebra Technologies Corporation)
• Original Assignee: Matrics Incorporated (Zebra Technologies Corporation)
• Inventors: Bandy, William R., Arneson, Michael R.
• Granted Patent: US 7,023,347 B2
• Time in Patent Office: Days
• US Class Current: 29/825
• CPC Class Codes: B29C 33/06 using radiation , e.g. electro-magnetic waves, induction heating
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/0775 arrangements for connecting the integrated circuit to the antenna
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/563 Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/67005 Apparatus not specifically provided for elsewhere processes per se H01L21/30, H01L21/46, H01L23/00; simple temporary support means, e.g. using adhesives, electric or magnetic means H01L21/68, H01L21/302
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 21/6836 Wafer tapes, e.g. grinding or dicing support tapes adhesive tapes in general C09J7/20
• CPC Class Codes: H01L 2221/68313 Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
• CPC Class Codes: H01L 2221/68327 used during dicing or grinding
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2223/54426 for alignment
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16227 the bump connector connecting to a bond pad of the item
• CPC Class Codes: H01L 2224/16238 the bump connector connecting to a bonding area protruding from the surface of the item
• CPC Class Codes: H01L 2224/29075 Plural core members
• CPC Class Codes: H01L 2224/2929 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/293 : with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/73203 : Bump and layer connectors
• CPC Class Codes: H01L 2224/81191 : wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83191 : wherein the layer connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/83851 : being an anisotropic conductive adhesive
• CPC Class Codes: H01L 2224/90 : Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 23/49855 : for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/544 : Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/12 : Structure, shape, material or disposition of the bump connectors prior to the connecting process
• CPC Class Codes: H01L 24/28 : Structure, shape, material or disposition of the layer connectors prior to the connecting process
• CPC Class Codes: H01L 24/29 : of an individual layer connector
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 24/90 : Methods for connecting semiconductor or solid state bodies using means for bonding not being attached to, or not being formed on, the body surface to be connected, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 24/96 : the devices being encapsulated in a common layer, e.g. neo-wafer or pseudo-wafer, said common layer being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/97 : the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00011 : Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01077 : Iridium [Ir]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/09701 : Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: Y10T 156/10 : Methods of surface bonding and/or assembly therefor
• CPC Class Codes: Y10T 29/49016 : Antenna or wave energy "plumbing" making
• CPC Class Codes: Y10T 29/49117 : Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49279 : including rolling or die forming, e.g., drawing, punching
• CPC Class Codes: Y10T 29/49474 : Die-press shaping
• CPC Class Codes: Y10T 29/49885 : with coating before or during assembling
• CPC Class Codes: Y10T 29/4998 : Combined manufacture including applying or shaping of fluent material
• CPC Class Codes: Y10T 29/5313 : Means to assemble electrical device

Abstract

A method, system, and apparatus for a die frame, and for transferring integrated circuit dies therewith, is described. In one aspect for making a die frame, a wafer that comprises a plurality of dies is attached to a surface of a tape structure. A grid of grooves is formed in the wafer to separate the plurality of dies on the surface of the tape structure. A portion of the tape structure that is accessible through the grooves of the grid is caused to harden into a grid shaped structure. The grid shaped structure removably holds the plurality of dies. One or more dies of the plurality of dies can be moved from the grid shaped structure onto a target surface. In an alternative aspect, when the grid of grooves is formed in the wafer to separate the plurality of dies on the surface of the tape structure, the surface of the tape structure is breached in the grooves. The breach causes a hardening material encapsulated in the tape structure to be released and to harden in the grooves into a grid shaped hardened material.

Claims

1. A method for forming a die frame, comprising:

(a) attaching a wafer that comprises a plurality of dies to a surface of a tape structure;

(b) forming a grid of grooves in the wafer to separate the plurality of dies on the surface of the tape structure; and

(c) causing a portion of the tape structure that is accessible through the grooves of the grid to harden into a grid shaped structure;

wherein the grid shaped structure removably holds the plurality of dies, wherein one or more dies of the plurality of dies can be moved from the grid shaped structure onto a target surface.

2. The method of claim 1, wherein the tape structure comprises a material that hardens when exposed to light, wherein step (c) comprises:

exposing the tape structure with light through the grooves of the grid.

3. The method of claim 2, wherein the tape structure comprises a material that hardens when exposed to ultraviolet (UV) light, wherein said exposing step comprises

exposing the tape structure with UV light through the grooves of the grid.

4. The method of claim 1, wherein step (c) comprises:

applying a material to the tape structure through the grooves of the grid, wherein the material causes the tape structure to harden.

5. The method of claim 4, wherein said applying step comprises:

spraying the material onto the tape structure through the grooves of the grid.

6. The method of claim 1, wherein step (b) comprises:

scribing the wafer on the surface of the tape structure.

7. The method of claim 2, further comprising:

(d) forming the tape structure to include a layer of the material.

8. The method of claim 7, wherein the material is a photoresist material, wherein step (d) comprises:

(d) forming the tape structure to include the layer of the photoresist material.

9. A die frame formed according to the method of claim 1.

10. A system for forming a die frame, comprising:

a wafer preparation module that applies a wafer to a surface of a tape structure, and forms a grid of grooves in the wafer to separate the plurality of dies on the surface of the tape structure; and

a hardening agent source that causes a portion of the tape structure that is accessible through the grooves of the grid to harden into a grid shaped structure;

wherein the grid shaped structure removably holds the plurality of dies, wherein one or more dies of the plurality of dies can be moved from the grid shaped structure onto a target surface.

11. The system of claim 10, wherein the tape structure comprises a material that hardens when exposed to light, wherein the hardening agent source comprises a light source that exposes the tape structure with light through the grooves of the grid.

12. The system of claim 11, wherein the tape structure comprises a material that hardens when exposed to ultraviolet (UV) light, wherein the hardening agent source exposes the tape structure with UV light through the grooves of the grid.

13. The system of claim 11, wherein the tape structure includes a layer of the material.

14. The system of claim 13, wherein the material is a photoresist material.

15. The system of claim 10, wherein the hardening agent source applies a material to the tape structure through the grooves of the grid that causes the tape structure to harden.

16. The system of claim 15, wherein the hardening agent source sprays the material onto the tape structure through the grooves of the grid.

17. A method for forming a die frame, comprising:

(a) attaching a wafer that comprises a plurality of dies to a surface of a tape structure, wherein the tape structure comprises an encapsulated hardening material;

(b) forming a grid of grooves in the wafer to separate the plurality of dies on the surface of the tape structure, wherein said forming step includes the step of breaching the surface of the tape structure in the grooves to cause the encapsulated hardening material to harden in the grooves into a grid shaped hardened material in the grooves of the grid.

18. The method of claim 17, further comprising:

(c) removing the tape structure so that the grid shaped hardened material removably holds the plurality of dies.

19. The method of claim 17, further comprising:

(c) prior to step (a), holding the tape structure with a support structure.

20. The method of claim 17, wherein step (b) comprises:

using a laser to form the grid of grooves and to breach the surface of the tape structure to cause the encapsulating hardening material to be released in the grooves.

21. The method of claim 17, wherein step (b) comprises:

using a saw to form the grid of grooves and to breach the surface of the tape structure cause the encapsulating hardening material to be released in the grooves.

22. A die frame formed according to the method of claim 17.

23. A system for forming a die frame, comprising:

a wafer preparation module that applies a wafer to a surface of a tape structure, and forms a grid of grooves in the wafer to separate the plurality of dies on the surface of the tape structure, wherein the tape structure comprises an encapsulated hardening material, wherein the wafer preparation module breaches the surface of the tape structure in the grooves when forming the grooves to cause the encapsulated hardening material to harden in the grooves into a grid shaped hardened material in the grooves of the grid.

24. The system of claim 23, further comprising:

a tape removal apparatus that removes the tape structure so that the grid shaped hardened material removably holds the plurality of dies.

25. The system of claim 23, wherein the wafer preparation module includes a laser to form the grid of grooves and to cause the encapsulating hardening material to be released in the grooves.

26. The system of claim 23, wherein the wafer preparation module includes a saw to form the grid of grooves and to cause the encapsulating hardening material to be released in the grooves.

27. A method for assembling a plurality of radio frequency identification (RFID) tags, comprising:

(a) positioning a die frame closely adjacent to a surface of a substrate such that a die of a plurality of dies removably held in the die frame is closely adjacent to the substrate; and

(b) transferring the die onto the closely adjacent substrate from the die frame.

28. The method of claim 27, further comprising:

(c) positioning the die frame closely adjacent to a surface of another substrate such that another die of the plurality of dies removably held in the die frame is closely adjacent to the another substrate; and

(d) transferring the another die onto the closely adjacent another substrate from the die frame.

29. The method of claim 28, further comprising:

(e) repeating steps (c) and (d) until all dies of the plurality of dies removably held in the die frame have been transferred to a corresponding substrate.

30. The method of claim 27, wherein step (b) comprises:

punching the die onto the closely adjacent substrate from the die frame

31. The method of claim 27, wherein step (b) comprises:

applying gas pressure to move the die onto the closely adjacent substrate from the die frame.