Capacitive-type acceleration sensor

• US 20040020291A1
• Filed: 08/01/2003
• Published: 02/05/2004
• Est. Priority Date: 08/02/2002
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Katsumata, Takashi, Kunda, Tomohito, Ikezawa, Toshiya
• Granted Patent: US 6,923,060 B2
• Time in Patent Office: Days
• US Class Current: 73/514.32
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0814 for translational movement of the mass, e.g. shuttle type

Abstract

A capacitive-type acceleration sensor includes a sensor chip that forms a moving electrode and a fixed electrode. The electrodes face each other while maintaining a detection gap. The sensor chip is joined to a circuit chip integrally. The circuit chip is mounted on a package via a resin adhesive. The adhesive is mixed with a filler of a material having a Young'"'"'s modulus higher than that of the resin.

Claims

1. A capacitive-type acceleration sensor comprising:

a sensor chip forming a moving electrode and a fixed electrode facing each other while maintaining a detection gap;

a circuit chip jointed to the sensor chip integrally;

a package; and

an adhesive provided to attach the circuit chip to the package, characterized in that

the adhesive is a mixture of resin and filler mixed with the resin and having a Young'"'"'s modulus higher than that of the resin.

2. A capacitive-type acceleration sensor according to claim 1, wherein the filler is a metal or a glass.

3. A capacitive-type acceleration sensor according to claim 2, wherein the filler is silver.

4. A capacitive-type acceleration sensor according to claim 1, wherein the adhesive is arranged at only a central portion of the circuit chip.

5. A capacitive-type acceleration sensor comprising:

a sensor chip forming a moving electrode and a fixed electrode facing each other while maintaining a detection gap to capacitively sense acceleration applied thereto, the sensor chip having a first resonance frequency;

a package; and

a resin adhesive provided to attach the sensor chip to the package, the resin adhesive operating as a spring to form a resonance system having a second resonance frequency higher than the first frequency,

wherein the resin adhesive includes a filler to increase the second resonance frequency than when no filler is mixed.