Systems with high density packing of micromachines

• US 20040021187A1
• Filed: 05/27/2003
• Published: 02/05/2004
• Est. Priority Date: 08/16/2001
• Status: Active Grant

• Current Assignee: Peter G. Hartwell, Robert G. Walmsley
• Original Assignee: Peter G. Hartwell, Robert G. Walmsley
• Inventors: Walmsley, Robert G., Hartwell, Peter G.
• Granted Patent: US 6,953,704 B2
• Time in Patent Office: Days
• US Class Current: 257/415
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Micromachine systems are provided. An embodiment of such a micromachine system includes a substrate that defines a trench. First and second microelectromechanical devices are arranged at least partially within the trench. Each of the microelectromechanical devices incorporates a first portion that is configured to move relative to the substrate. Methods also are provided.

Claims

1. A micromachine system comprising:

a substrate defining a trench;

a first microelectromechanical device arranged at least partially within said trench, said first microelectromechanical device including a first portion, said first portion being configured to move relative to said substrate; and

a second microelectromechanical device arranged at least partially within said trench and adjacent to said first microelectromechanical device, said second microelectromechanical device including a first portion, said first portion being configured to move relative to said substrate.

2. The micromachine system of claim 1, further comprising:

a first anchor fixed in position relative to said substrate, said first anchor being configured to maintain said first portion of said first microelectromechanical device at least partially within said trench; and

a second anchor fixed in position relative to said substrate, said second anchor being configured to maintain said first portion of said second microelectromechanical device at least partially within said trench.

3. The micromachine system of claim 1, further comprising:

means for maintaining said first portion of said first microelectromechanical device at least partially within said trench; and

means for maintaining said first portion of said second microelectromechanical device at least partially within said trench.

4. The micromachine system of claim 1, wherein said first portion of said first microelectromechanical device and said first portion of said second microelectromechanical device are configured to move independently of each other.

5. The micromachine system of claim 1, further comprising:

a separator disposed at least partially between said first microelectromechanical device and said second microelectromechanical device, said separator being adapted to prevent said first microelectromechanical device from contacting said second microelectromechanical device.

6. The micromachine system of claim 1, further comprising:

means for preventing said first microelectromechanical device from contacting said second microelectromechanical device.

7. The micromachine system of claim 2, wherein:

said first microelectromechanical device includes a first flexure, said first flexure having a first end affixed to said first anchor, said first flexure being affixed to said first portion of said first microelectromechanical device, said first flexure being adapted to deform such that said first portion of said first microelectromechanical device is capable of moving relative to said substrate; and

said second microelectromechanical device includes a first flexure, said first flexure of said second microelectromechanical device having a first end affixed to said second anchor, said first flexure of said second microelectromechanical device being affixed to said first portion of said second microelectromechanical device, said first flexure of said second microelectromechanical device being adapted to deform such that said first portion of said second microelectromechanical device is capable of moving relative to said substrate.

8. The micromachine system of claim 5, wherein said separator is a micro-fabricated beam.

9. The micromachine system of claim 7, wherein said first microelectromechanical device includes a second flexure, said second flexure having a first end affixed to said second anchor, said second flexure being affixed to said first portion of said first microelectromechanical device;

and

wherein said second microelectromechanical device includes a second flexure, said second flexure of said second microelectromechanical device having a first end affixed to said first anchor, said second flexure of said second microelectromechanical device being affixed to said first portion of said second microelectromechanical device.

10. The micromachine system of claim 7, further comprising:

a third microelectromechanical device arranged at least partially within said trench, said third microelectromechanical device including a first portion and a first flexure, said first portion of said third microelectromechanical device being configured to move relative to said substrate, said first flexure of said third microelectromechanical device having a first end affixed to said first anchor, said first flexure of said third microelectromechanical device being affixed to said first portion of said third microelectromechanical device, said first flexure of said third microelectromechanical device being adapted to deform such that said first portion of said third microelectromechanical device is capable of moving relative to said substrate.

11. The micromachine system of claim 8, further comprising:

a separator disposed at least partially between said first microelectromechanical device and said second microelectromechanical device, said separator being adapted to prevent said first microelectromechanical device from contacting said second microelectromechanical device, said separator being adapted to deform in response to contact by said first portion of said first microelectromechanical device and said first portion of said second microelectromechanical device.

12. The micromachine system of claim 8, wherein said first flexure of said first microelectromechanical device and said first flexure of said second microelectromechanical device are micro-fabricated beams.

13. The micromachine system of claim 10, further comprising:

a fourth microelectromechanical device arranged at least partially within said trench, said fourth microelectromechanical device including a first portion and a first flexure, said first portion of said fourth microelectromechanical device being configured to move relative to said substrate, said first flexure of said fourth microelectromechanical device having a first end affixed to said first anchor, said first flexure of said fourth microelectromechanical device being affixed to said first portion of said fourth microelectromechanical device, said first flexure of said fourth microelectromechanical device being adapted to deform such that said first portion of said fourth microelectromechanical device is capable of moving relative to said substrate.

14. A method for forming an array of micromachines, comprising the steps of:

providing a substrate;

forming a trench in the substrate;

arranging a first microelectromechanical device at least partially within the trench, the first microelectromechanical device including a first portion configured to move relative to the substrate; and

arranging a second microelectromechanical device at least partially within the trench, the second microelectromechanical device including a first portion configured to move relative to the substrate.

15. The method of claim 14, further comprising the steps of:

providing a first anchor fixed in position relative to the substrate;

maintaining the first portion of the first microelectromechanical device at least partially within the trench with the first anchor;

providing a second anchor fixed in position relative to the substrate; and

maintaining the first portion of the second microelectromechanical device at least partially within the trench with the second anchor.

16. The method of claim 14, further comprising the steps of:

providing a separator; and

preventing the first microelectromechanical device from contacting the second microelectromechanical device by arranging the separator at least partially between the first microelectromechanical device and the second microelectromechanical device.

17. The method of claim 14, wherein the first microelectromechanical device includes a first flexure, the first flexure being adapted to deform;

and

further comprising the steps of;

affixing a first end of the first flexure to the first anchor; and

affixing the first flexure to the first portion of the first microelectromechanical device such that the first portion of the first microelectromechanical device is capable of moving relative to the substrate.

18. The method of claim 14, wherein the second microelectromechanical device includes a first flexure, the first flexure of the second microelectromechanical device being adapted to deform;

and

further comprising the steps of;

affixing a first end of the first flexure of the second microelectromechanical device to the second anchor; and

affixing the first flexure of the second microelectromechanical device to the first portion of the second microelectromechanical device such that the first portion of the second microelectromechanical device is capable of moving relative to the substrate.

19. The method of claim 17, wherein the first microelectromechanical device includes a second flexure, the second flexure being adapted to deform;

and

further comprising the steps of;

affixing a first end of the second flexure to the second anchor; and

affixing the second flexure to the first portion of the first microelectromechanical device such that the first portion of the first microelectromechanical device is capable of moving relative to the substrate.

20. The method of claim 18, wherein the second microelectromechanical device includes a second flexure, the second flexure of the second microelectromechanical device being adapted to deform;

and

further comprising the steps of;

affixing a first end of the second flexure of the second microelectromechanical device to the first anchor; and

affixing the first flexure of the second microelectromechanical device to the first portion of the second microelectromechanical device such that the first portion of the second microelectromechanical device is capable of moving relative to the substrate.