Stress reduction in flip-chip PBGA packaging by utilizing segmented chips and/or chip carriers

• US 20040021205A1
• Filed: 07/29/2003
• Published: 02/05/2004
• Est. Priority Date: 03/20/2002
• Status: Active Grant

• Current Assignee: GlobalFoundries, Inc.
• Original Assignee: Charles G. Woychik, Krishna Darbha, Matthew M. Reiss, Miguel A. Jimarez, Sanjeev B. Sathe
• Inventors: Darbha, Krishna, Woychik, Charles G., Jimarez, Miguel A., Sathe, Sanjeev B., Reiss, Matthew M.
• Granted Patent: US 6,989,607 B2
• Time in Patent Office: Days
• US Class Current: 257/620
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/92125 the second connecting process involving a layer connector
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/15151 the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Abstract

A method and structure to electrically couple a semiconductor device to a substrate that is divided into a plurality of segments. Alternatively, a semiconductor device may be divided into a plurality of segments and the plurality of segments are electrically coupled to a single substrate.

Claims

1. An electronic structure, comprising:

a substrate, wherein the substrate is divided into a plurality of segments, and

a semiconductor device electrically coupled to each of the segments.

2. The electronic structure of claim 1, wherein the semiconductor device is symmetrically coupled to each segment.

3. The electronic structure of claim 1, wherein the semiconductor device is not symmetrically coupled to each segment.

4. The electronic structure of claim 1, wherein a first segment and a second segment of the plurality of segments are congruent with respect to each other.

5. The electronic structure of claim 1, wherein a first segment and a second segment of the plurality of segments are not congruent with respect to each other.

6. The electronic structure of claim 1, wherein the plurality of segments are square segments.

7. The electronic structure of claim 1, wherein the plurality of segments consists of 4 segments.

8. The electronic structure of claim 1, wherein the substrate is a chip carrier, and wherein the semiconductor device is a semiconductor chip.

9. An electronic structure, comprising:

a substrate; and

a semiconductor device electrically coupled to the substrate, wherein the semiconductor is divided into a plurality of segments.

10. The electronic structure of claim 9, wherein the length of each segment of the semiconductor device is greater than or equal to 5 millimeters.

11. The electronic structure of claim 9, wherein a first segment and a second segment of the plurality of segments are congruent with respect to each other.

12. The electronic structure of claim 9, wherein a first segment and a second segment of the plurality of segments are not congruent with respect to each other.

13. The electronic structure of claim 9, wherein the plurality of segments are square segments.

14. A method for forming an electronic structure, comprising:

dividing a substrate into a plurality of segments, and

electrically coupling a semiconductor device to each segment of the plurality of segments of the substrate.

15. The method of claim 14, wherein the semiconductor device is symmetrically coupled to each segment.

16. The method of claim 14, wherein the semiconductor device is not symmetrically coupled to each segment.

17. The method of claim 14, wherein a first segment and a second segment of the plurality of segments are congruent with respect to each other.

18. The method of claim 14, wherein a first segment and a second segment of the plurality of segments are not congruent with respect to each other.

19. The method of claim 14, wherein the plurality of segments consists of 4 segments.

20. The method of claim 15, wherein the plurality of segments are square segments.