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Piezoelectric actuator and pump using same

  • US 20040021398A1
  • Filed: 05/28/2003
  • Published: 02/05/2004
  • Est. Priority Date: 09/18/2000
  • Status: Active Grant
First Claim
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1. [Amended] The method of making piezoelectric actuators 14 from piezoelectric wafers 38 wherein the improvement comprises the steps of:

  • a. cleaning the piezoelectric wafer 38 and enclosing metallic layers 40 and 42 using a solvent that does not leave a residue;

    b. coating both sides of the piezoelectric wafer 38 with a thin layer, not more than 0.01 mm[0.005″

    ], of a high performance polyimide gel adhesive 41, the gel containing a minimum of 25% solids to allow sufficient material for a good bond after the solvent is driven off;

    c. placing both sides of the piezoelectric wafer 38 under a standard heat lamp for about five minutes to remove most of the solvent from the gel and start the polyimide gel polymerization process;

    d. once the adhesive is dry to the touch, placing the piezoelectric wafer 38 between the metallic layers 40 and 42 to form a piezoelectric actuator 14;

    e. assembling a press comprising two 300 mm[12″

    ] square by 6 mm[¼



    ] thick plates of aluminum 101 held together with thumbscrews 102, at least two on each edge, covering the bottom plate 101 of the press with a sheet of polyimide film 104, placing multiple piezoelectric actuators 14 on the film and covering with a sheet of high temperature 3 mm[⅛



    ] thick rubber 106;

    f. making the thumbscrews 102 finger tight;

    g. placing the press 100 in a standard convection oven for about thirty minutes at about 200°

    C.;

    h. removing the press 100 from the oven, allowing it to cool to a safe temperature, and removing the actuators 14 from the press.

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