Reduced inductance contactor

• US 20040022039A1
• Filed: 07/31/2002
• Published: 02/05/2004
• Est. Priority Date: 07/31/2002
• Status: Active Grant

• Current Assignee: NXP USA, Inc. (NXP Semiconductors NV)
• Original Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Inventors: Collins, Joseph, Ortiz, Alfred E.
• Granted Patent: US 7,034,558 B2
• Time in Patent Office: Days
• US Class Current: 361/767
• CPC Class Codes: G01R 1/0416 Connectors, terminals G01R1/0425 and G01R1/0433 take precedence; with measurement function for battery poles G01R31/364

Abstract

In one embodiment, a contactor (200) is provided. The contactor (200) comprises a device side (210), a test circuit board side (155), and a thickness (110). The device side (210) is in communication with at least three electrical contact points (140, 141, 142) of the device (170). The test circuit board side (155) includes a fourth electrical contact point (193) in electrical communication with the circuit board (150). The contactor (200) also includes a first electrical pathway (220) between the first electrical contact point (140) and the second electrical contact point (142). The first electrical pathway (220) bypasses the circuit board (150). The contactor (200) further includes a second electrical pathway (270) between the third electrical contact point (142) and the fourth electrical contact point (193).

Claims

1. A contactor to provide electrical connection between an electrical device and a circuit board, wherein the device comprises at least three electrical contact points, the contactor comprising:

a device side;

a circuit board side;

wherein the device side comprises at least three electrical contact points to provide electrical contact with at least three electrical contact points of the device and the circuit board side comprises a fourth electrical contact point to provide electrical contact with the circuit board;

a first electrical pathway between the first electrical contact point of the device side and the second electrical contact point of the device side,

wherein the first electrical pathway bypasses the circuit board; and

a second electrical pathway between the third electrical contact point of the device side and the fourth electrical contact point of the circuit board side.

2. The contactor of claim 1, wherein the first electrical pathway is near the device side of the contactor.

3. The contactor of claim 1, further comprising a conductive slug located between at least the first electrical contact point of the device side and the second electrical contact point of the device side;

wherein the first electrical pathway comprises an electrical pathway through the slug.

4. The contactor of claim 1, further comprising a compliant base between the device side and the circuit board side;

and a flexible circuit between the first electrical contact point of the device side and the second electrical contact point of the device side.

5. The contactor of claim 4, wherein when subjected to a force, the compliant base gives beneath the circuit and the circuit makes electrical contact with the first electrical contact point of the device side and the second electrical contact point of the device side.

6. The contactor of claim 1, wherein the first electrical contact point of the device side comprises an emitter pin contact for an amplifier and the second electrical contact point of the device side is grounded.

7. A system for electrically connecting a device under test and a test circuit board, the device comprising at least a first electrical contact point, a second electrical contact point, and a third electrical contact point, the system comprising:

means for electrically bypassing the test circuit board between the first electrical contact point and the second electrical contact point; and

means for bringing the third electrical contact point in electrical communication with the test circuit board.

8. The system of claim 7, wherein the means for electrically bypassing further comprises means for shorting the first electrical contact point to the second electrical contact point.

9. The system of claim 7, wherein the means for electrically bypassing comprises a slug.

10. The system of claim 7, wherein the means for electrically bypassing comprises a flexible circuit.

11. The system of claim 7, wherein means for bypassing comprise a means for shorting an emitter pin of an amplifier to ground.

12. A method for testing an electronic device, the method comprising:

electrically connecting the device to a test circuit board, the device having at least a first electrical contact point, a second electrical contact point, and a third electrical contact point;

electrically bypassing the test circuit board between the first electrical contact point and the second electrical contact point;

bringing the third electrical contact point in communication with the test circuit board; and

applying a test method to the device.

13. The method of claim 12, wherein the device comprises an amplifier.

14. A method as in claim 13, wherein the applying a test method comprises applying a gain test.

15. A method as in claim 13, wherein the applying a test method comprises a applying third order intercept test.

16. A method as in claim 13, wherein the applying a test method comprises a applying noise figure test.

17. A method as in claim 13, wherein the electrically bypassing the test circuit board between the first electrical contact point and the second electrical contact point further comprises shorting the emitter pin of the amplifier to ground.

18. A method of reducing the inductance between an amplifier under test and a test circuit board, the method comprising:

temporarily bringing the amplifier in electrical communication with the test circuit board; and

electrically bypassing the test circuit board between an emitter pin of the amplifier and a second pin of the amplifier.

19. The method of claim 18, further comprising grounding the second pin.