Methods of manufacturing a printed circuit board shielded against interfering radiation

• US 20040022046A1
• Filed: 07/10/2003
• Published: 02/05/2004
• Est. Priority Date: 10/06/2000
• Status: Active Grant

• Current Assignee: Stork Prints BV
• Original Assignee: Stork Prints BV
• Inventors: Leerkamp, Peter, Blankenborg, Stephanus Gerardus
• Granted Patent: US 7,089,646 B2
• Time in Patent Office: Days
• US Class Current: 361/816
• CPC Class Codes: H05K 3/363 by soldering
• CPC Class Codes: H05K 9/003 made from non-conductive materials comprising an electro-conductive coating H05K9/0031 takes precedence
• CPC Class Codes: Y10T 29/49002 Electrical device making

Abstract

Methods for the production of a board (11) with printed circuit (12) shielded against interfering radiation and having electronic components (14) comprise the steps of positioning of the electronic components (14) on contact points (15) designed for them, and the application of a shield (20), comprising a preformed metallized plastic film (30) over the top of the electronic components (14) and in electrical contact with the earth (13) on the board (11) with printed circuit (12), and also fixing the electronic components (14) on the board (11) with printed circuit (12) by means of an electrically conducting fixing agent (16); and fixing of the shield (20) on the board (11) with printed circuit (12).

Claims

1. Method for the production of a board with printed circuit shielded with a shield against interfering radiation and having at least one electronic component, which method comprises the following steps:

e) the application of flowable electrically conducting fixing agent (16) to contact points (15) for the at least one electronic component (14) on the board (11) with printed circuit (12) and to the earth (13) for the shield (20);

f) the positioning of the at least one electronic component (14) on the contact points (15) concerned of the board (11) with printed circuit (12);

g) the positioning of a shield (20), comprising a preformed metallized plastic film (30), over the top of the at least one electronic component (14) on the earth of the board (11) with printed circuit (12); and

h) the simultaneous fixing of the at least one electronic component (14) on the contact points (15) and the shield (20) on the earth by increasing the temperature to above the flowing point of the flowable electrically conducting fixing agent (16).

2. Method according to claim 1, characterized in that the shield (20) comprises a substantially box-shaped element (22), the side wall (26) of which is provided with a fixing edge (28) extending parallel to the main surface of the board (11).

3. Method according to one of the preceding claims, characterized in that the steps b) and c) are carried out with a so-called pick-and-place device.

4. Method according to claim 3, characterized in that the steps b) and c) are carried out with the same pick-and-place device.

5. Method according to one of the preceding claims, characterized in that the plastic (34) of the metallized plastic film (30) is selected from temperature-resistant materials, such as polyimide, PC, PEEK, PES, polyamide and the like or mixtures thereof, preferably a polyimide.

6. Method according to one of the preceding claims, characterized in that the metal (32) of the metallized plastic film (30) is selected from Sn, Ni, Cu, Pb, alloys and mixtures thereof.

7. Method according to claim 6, characterized in that the metal (32) comprises tin, lead or an alloy thereof.

8. Method for the production of a board with printed circuit shielded against interfering radiation and having at least one electronic component, which method comprises the following steps:

d) the positioning and fixing of the at least one electronic component (14) on contact points (15) concerned of the board (11) with printed circuit (12);

e) the positioning of a shield (20), comprising a preformed metallized plastic film (30), over the top of the electronic component (14) on the earth (13) of the board (11) with printed circuit (12), the shield (20) being a substantially box-shaped element (22), the side wall (26) of which is provided with a fixing edge (28) extending parallel to the main surface of the board (11), which fixing edge (28) is provided with through apertures (29); and

f) the fixing of the shield (20) on the earth of the board (11) with printed circuit, using a fixing agent.

9. Method according to claim 8, characterized in that the fixing agent is single-sided adhesive tape (31).

10. Method according to one of the preceding claims 8 or 9, characterized in that the steps a) and b) are carried out with a so-called pick-and-place device.

11. Method according to one of the preceding claims 8-10, characterized in that the plastic (34) of the metallized plastic film (30) is selected from temperature-resistant materials, such as polyimide, PC, PEEK, PES, polyamide and the like or mixtures thereof, preferably a polyimide.

12. Method according to one of the preceding claims 8-11, characterized in that the metal (32) of the metallized plastic film (30) is selected from Sn, Ni, Cu, Pb, alloys and mixtures thereof.

13. Method according to claim 12, characterized in that the metal (32) comprises tin, lead or an alloy thereof.

14. Method for the production of a board with printed circuit shielded against interfering radiation and having at least one electronic component, which method comprises the following steps:

d) the positioning and fixing of the at least one electronic component (14) on contact points (15) concerned of the board (11) with printed circuit (12);

e) the positioning of a shield (20), comprising a preformed metallized plastic film (30), over the top of the at least one electronic component (14) on the earth (13) of the board (11) with printed circuit (12), and

f) the fixing of the shield (20) on the earth of the board (11) with printed circuit, using a conducting, double-sided adhesive material (40), the adhesion strength of the conducting, double-sided adhesive material (40) to the shield (20) being greater than its adhesion strength to the earth of the board (11) with printed circuit (12).

15. Method according to claim 14, characterized in that the conducting, strip-shaped, double-sided adhesive material (40) is a conducting metal-containing acrylic polymer.

16. Method according to claim 15, characterized in that the conducting metal is selected from silver, nickel, copper, alloys and mixtures thereof.

17. Method according to one of claims 14-16, characterized in that the steps a) and b) are carried out using different pick-and-place machines.

18. Method according to one of the preceding claims 14-17, characterized in that the plastic (34) of the metallized plastic film (30) is selected from temperature-resistant materials, such as polyimide, PC, PEEK, PES, polyamide and the like or mixtures thereof, preferably a polyimide.

19. Method according to one of the preceding claims 15-19, characterized in that the metal (32) of the metallized plastic film (30) is selected from Sn, Ni, Cu, Pb, alloys and mixtures thereof.

20. Method according to claim 19, characterized in that the metal (32) comprises tin, lead or an alloy thereof.

21. Method according to one of the preceding claims 14-20, characterized in that the shield (20) is a substantially box-shaped element (22), the side wall (26) of which is provided with a fixing edge (28) extending parallel to the main surface of the board (11).