Carrier substrate for Raman spectrometric analysis

• US 20040023046A1
• Filed: 04/15/2003
• Published: 02/05/2004
• Est. Priority Date: 08/04/1998
• Status: Abandoned Application

• Current Assignee: Falko Schlottig, Jean-Francois Paulet, Kurt Sekinger, Marcus Textor, Norbert Meyer, Ulrich Schnaut
• Original Assignee: Falko Schlottig, Jean-Francois Paulet, Kurt Sekinger, Marcus Textor, Norbert Meyer, Ulrich Schnaut
• Inventors: Meyer, Norbert, Sekinger, Kurt, Schnaut, Ulrich, Paulet, Jean-Francois, Schlottig, Falko, Textor, Marcus
• Application Number:
  US10/414,145
• Publication Number:
  US 20040023046A1
• Time in Patent Office: Days
• US Class Current: 428/469
• CPC Class Codes: G01J 3/44 Raman spectrometry; Scattering spectrometry ; Fluorescence spectrometry
• CPC Class Codes: G01N 21/658 enhancement Raman, e.g. surface plasmons
• CPC Class Codes: Y10T 428/12736 Al-base component
• CPC Class Codes: Y10T 428/2913 Rod, strand, filament or fiber

Abstract

A process for surface-enhanced Raman spectrometric analysis of substances comprises the steps of providing substances to be analyzed, providing a carrier-layer with a multiplicity of nanobodies for receiving the substances to be analyzed, the multiplicity of nanobodies formed on at least one side of the carrier layer, whereby each nanobody has a rod-like stem area lying on the carrier layer and at least two branch elements formed on the stem area, and the density of the branch elements is a least 10⁸/cm²; locating the substances on the carrier layer; and irradiating the substances to provide a Raman scatter.

Claims

1. Carrier substrate for surface-enhanced Raman spectrometric analysis of substances, comprising a carrier layer (12) and a multiplicity of nanobodies (14) formed on at least one side of the carrier layer (12), characterised in that each nanobody (14) has a rod-like stem area (16) lying on the carrier layer (12) and at least two, preferably 2 to 4, branch elements (20) formed on the stem area (16), and the density of the branch elements (20) is at least 10⁸/cm².

2. Carrier substrate according to claim 1, characterised in that each nanobody (14) has a maximum cross sectional diameter (d) between 10 and 250 nm, in particular between 10 and 150 nm, and a height (h) of 30 nm to 5 μ

m, in particular 30 nm to 2 μ

m.

3. Carrier substrate according to claim 1 or 2, characterised in that the height (h) of the individual rod-like nanobodies (14) varies by no more than ±

3% of the mean height (h_D) determined from all rod-like nanobodies (14).

4. Carrier substrate according to any of claims 1 to 3, characterised in that the density of the branch elements (20) is 10⁸ to 10¹²/cm².

5. Carrier substrate according to any of claims 1 to 4, characterised in that 95% of all branch elements (20) have an even height (h_s), where an even height (h_s) means that the height (h_s) varies by no more than ±

5% of the height (h_m) of the branch elements (20) averaged over the entire substrate.

6. Carrier substrate according to any of claims 1 to 5, characterised in that the nanobodies (14) and the carrier layer (12) consist of the same material, preferably metal, in particular gold or silver.

7. Process for production of a carrier substrate for surface-enhanced Raman spectrometric analysis of substances, comprising a carrier layer (12) and a multiplicity of nanobodies (14) formed on the carrier layer (12) each with at least one end tip (21), where each nanobody (14) has a maximum cross sectional diameter (d) between 10 and 250 nm and a height (h) of 30 nm to 5 μ

m and the density of the end tips (21) is at least 10⁸/cm², characterised in that

a) in a first step a mould body (22) with a mould body surface (23) mirror-inverted to the required carrier substrate surface (18) is created in that a substrate body (24) of an anodisable metal is oxidised anodically in an electrolyte redissolving the metal oxide concerned, whereby at least on one substrate body surface (25) is formed a mould layer (26) of metal oxide comprising a barrier layer (28) adjacent to the substrate body surface (25) and a porous layer (30) lying on this, and the porous layer (30) contains pore cavities (36) formed mirror-inverted to the required nanobodies (14);

b) in a second step the mould body surface (23) is coated throughout by chemical and/or electrolytic methods such that the pore cavities (36) are completely filled with a coating material and also a carrier layer (12) connecting the pore cavities (36) is formed from a coating material, and the carrier layer (12) constitutes a cohesive mechanically supportive layer;

c) and in a third step the mould body (22) is removed such that at least the end tips (21) are exposed.

8. Process according to claim 7, characterised in that the substrate body (24) consists of aluminium or an aluminium alloy.

9. Process according to claim 7 or 8, characterised in that the oxidation of the substrate (24) to be performed in the first process step takes place in several anodising steps, where in a first anodising step the anodising voltage is increased continuously or in stages from 0 to a first value U₁ and in a further anodising step the anodising voltage is reduced continuously or in stages to a second value U₂ lower than U₁.

10. Process according to claim 9, characterised in that to form cylindrical or truncated conical long pore stem areas (32), the first value U₁ of the anodising voltage f lies between 12 and 80 V and the second value U₂ of the anodising voltage is between 10 and 20 V to form at least two pore branches (34) per pore stem area (32) on the end of each pore (36) directed towards the substrate body surface (25).

11. Process according to any of claims 7 to 10, characterised in that the coating of the mould body surface (23) to be performed in the second process step takes place by chemical and/or electrolytic methods.

12. Process according to claim 11, characterised in that the coating of the mould body surface (23) to be performed in the second process step takes place in three stages, where in a first stage the mould body surface (23), and in particular the pore cavities (36), are seeded electrolytically with coating material, in a second stage by current-free chemical deposition the pore cavities (36) are completely filled with coating material and the chemical deposition of coating material is continued until on the mould body surface (23) lying between the pore cavities (36) is formed a layer of 100 nm to 2 μ

m of coating material and in a third stage the coating is reinforced galvanically until a coating layer thickness of 10 to 20 μ

m is formed.

13. Process according to any of claims 7 to 12, characterised in that gold or silver is selected as a coating material.

14. Process according to any of claims 7 to 13, characterised that the removal of the mould body (22) to be performed in the third process step takes place by chemical etching of the mould layer (26).

15. Process according to any of claims 7 to 13, characterised in that the removal of the mould body (22) to be performed in the third process step takes place in two stages, where firstly the entire substrate body (24) is chemically etched away and in a second stage at least part of the mould layer (26) is removed by chemical etching or plasma etching.

16. Process according to any of claims 7 to 15, characterised in that the nanobodies (14), by secondary treatment by means of chemical or electrolytic etching or by plasma etching or by deposition of an additional thin layer, in particular of gold or silver, are optimised with regard to their surface-enhancing properties for Raman spectrometry.