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Method for selectively metalizing dieletric materials

  • US 20040026254A1
  • Filed: 08/04/2003
  • Published: 02/12/2004
  • Est. Priority Date: 09/26/2000
  • Status: Abandoned Application
First Claim
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1. Method for selectively metallizing dielectric materials, characterized in that the respective dielectric material is covered with an activating layer consisting of conductive material and that structuring of the activating layer through a subsequent laser treatment occurs in such a way that discrete conductive structures are formed, which are subsequently metallized.

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