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Semiconductor devices and manufacturing method therefor and electronic commerce method and transponder reader

  • US 20040026519A1
  • Filed: 06/27/2003
  • Published: 02/12/2004
  • Est. Priority Date: 08/08/2002
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • an IC chip for wirelessly transmitting/receiving data;

    electrodes formed on a front surface and a rear surface of said IC chip; and

    a first conductor and a second conductor connected respectively to said electrodes, wherein said first conductor and said second conductor are connected outside said IC chip to form an antenna.

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