Encapsulated organic-electronic component, method for producing the same and use thereof

• US 20040026689A1
• Filed: 07/25/2003
• Published: 02/12/2004
• Est. Priority Date: 08/18/2000
• Status: Active Grant

• Current Assignee: PolyIC GmbH & Co. KG (Leonhard KURZ Stiftung & Company KG)
• Original Assignee: PolyIC GmbH & Co. KG (Leonhard KURZ Stiftung & Company KG)
• Inventors: Rost, Henning, Bernds, Adolf, Clemens, Wolfgang, Fix, Walter
• Granted Patent: US 7,875,975 B2
• Time in Patent Office: Days
• US Class Current: 257/40
• CPC Class Codes: G06K 19/0773 the record carrier comprising means to protect itself against external heat sources
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07779 the inductive antenna being a coil
• CPC Class Codes: G06K 19/07783 the coil being planar
• CPC Class Codes: G06K 19/07786 the antenna being of the HF type, such as a dipole
• CPC Class Codes: H01L 23/5388 for flat cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H10K 10/46 Field-effect transistors, e.g. organic thin-film transistors [OTFT] H10K10/43 takes precedence
• CPC Class Codes: H10K 19/901 Assemblies of multiple devices comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching
• CPC Class Codes: H10K 50/84 Passivation; Containers; Encapsulations
• CPC Class Codes: H10K 71/13 using printing techniques, e.g. ink-jet printing or screen printing
• CPC Class Codes: H10K 71/50 Forming devices by joining two substrates together, e.g. lamination techniques
• CPC Class Codes: H10K 77/111 Flexible substrates

Abstract

An electronic circuit having at least one electronic component comprised of an organic material, and arranged between at least two layers forming a barrier, wherein the layers protect the at least one component against an influence of light, air or liquid.

Claims

1. An electronic circuit (1), comprising electronic components (3) consisting especially of organic material, the component/components (3) being arranged between at least two layers (2, 2′

) forming a barrier and protected by these layers against the influence of light and/or air and/or a liquid such as water.

2. The electronic circuit as claimed in claim 1, characterized in that the barrier layer (2) comprises at least one layer comprising a film of plastic.

3. The electronic circuit as claimed in claim 1 or 2, characterized in that it is an organic field-effect transistor in which the following construction is realized:

source/drain electrode on the first layer, forming a barrier, a substrate, embedded in a semiconducting layer with an adjoining layer of insulating material, this layer still being uncrosslinked, and, following the uncrosslinked insulating layer, a gate electrode, which is followed by the second layer, forming a barrier, a covering layer.

4. The electronic circuit as claimed in claim 3, in which the covering layer is a substrate and/or a carrier such as a flexible film.

5. The electronic circuit as claimed in one of the preceding claims 3 or 4, in which adjustment marks are integrated in the still uncrosslinked insulating layer.

6. The electronic circuit as claimed in one of the preceding claims, characterized in that the barrier layer (2) is a metallic and/or non-metallic layer.

7. The electronic circuit as claimed in one of claims 1 to 6, characterized in that the metallic layer is selected from aluminum, copper or chromium.

8. The electronic circuit as claimed in one of claims 1 to 7, characterized in that the components (3) are selected from active components.

9. The electronic circuit as claimed in claim 8, characterized in that the active components are, in particular, an integrated circuit and/or a rectifier diode.

10. The electronic circuit as claimed in one of claims 1 to 9, characterized in that the components (3) are selected from passive components.

11. The electronic circuit as claimed in one of claims 1 to 10, characterized in that the passive components are, in particular, resistors, capacitors or coils.

12. The electronic circuit as claimed in one of claims 1 to 11, characterized in that it comprises a coil arrangement (9, 10) or the like or is combined with such an arrangement.

13. The electronic circuit as claimed in one of the preceding claims, characterized in that it is connected in a conducting manner to external contacts (8).

14. A method for producing an electronic circuit, comprising electronic components (3) consisting especially of organic material, in particular as claimed in one of claims 1 to 13, with the following steps:

constructing a layer (2) forming a barrier,

arranging electronic components (3) to form an electronic circuit (1) on the barrier layer (2),

connecting electrical conductor tracks (7) to electrical contacts (8),

applying a further layer (2′

), comprising at least one barrier layer (2), over the electronic components (3) to protect them against light and/or air and/or water.

15. The method as claimed in claim 14, characterized in that the electronic circuit (1) is formed as a tag.

16. The method as claimed in claim 14, characterized in that the electronic circuit (1) is formed as a sensor.

17. A method for producing an electronic circuit as claimed in one of claims 1 to 13, in which

at least one source electrode and one drain electrode are formed on a carrier and coated with a semiconducting layer, on which a layer with a still uncrosslinked insulator is applied (production of the substructure);

a gate electrode with a layer of uncrosslinked insulator lying over it is applied on a second substrate (production of the superstructure) and

the two carriers are then superposed in such a way that the two uncrosslinked insulating layers come to lie one on top of the other and then

the crosslinking of the insulator is initiated.

18. The use of an electronic circuit (1) as claimed in one of claims 1 to 13 for producing a tag.

19. The use of an electronic circuit (1) as claimed in one of claims 1 to 13 for producing a sensor.