Light emitting element and manufacturing method for the same
First Claim
Patent Images
1. A light emitting element, comprising:
- a light emitting layer;
a rectangular first principal surface being parallel to the light emitting layer;
a rectangular second principal surface opposing to the first principal surface so that the light emitting layer is sandwiched between the first and second principal surfaces; and
first through fourth side surfaces of the light emitting element provided with a rough surface, the first through fourth side surfaces connecting between the first principal surface and the second principal surface, respectively so as to define a solid shape.
1 Assignment
0 Petitions
Accused Products
Abstract
A light emitting element includes: a light emitting layer; a rectangular first principal surface being parallel to the light emitting layer; a rectangular second principal surface opposing to the first principal surface so that the light emitting layer is sandwiched between the first and second principal surfaces; and first through fourth side surfaces of the light emitting element provided with a rough surface, the first through fourth side surfaces connecting between the first principal surface and the second principal surface, respectively so as to define a solid shape.
-
Citations
18 Claims
-
1. A light emitting element, comprising:
-
a light emitting layer;
a rectangular first principal surface being parallel to the light emitting layer;
a rectangular second principal surface opposing to the first principal surface so that the light emitting layer is sandwiched between the first and second principal surfaces; and
first through fourth side surfaces of the light emitting element provided with a rough surface, the first through fourth side surfaces connecting between the first principal surface and the second principal surface, respectively so as to define a solid shape. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
-
-
11. A manufacturing method for a light emitting element, comprising:
-
forming first cuts in a first direction using a V-shaped blade on a first principal surface of a semiconductor substrate having a light emitting layer;
forming second cuts in a second direction perpendicular to the first direction facing the first principal surface using the V-shaped blade on a second principal surface of the semiconductor substrate having the light emitting layer;
separating the semiconductor substrate into chips along the first and second cuts; and
forming rough surfaces on side surfaces of the first and second cuts by a wet etching process. - View Dependent Claims (12, 13, 14)
-
-
15. A manufacturing method for a light emitting element, comprising:
-
separating a semiconductor substrate having a light emitting layer into chips; and
forming rough surfaces on all of side surfaces of the chips by wet etching using hydrofluoric acid. - View Dependent Claims (16, 17, 18)
-
Specification