Power source circuit device
First Claim
1. A power-supply circuit device comprising:
- a MOSFET;
a packaging sealing the MOSFET therein; and
a plurality of lead pins led out from a side wall of a main body of the packaging, a drain terminal of the MOSFET being connected to a central lead pin of the plurality of lead pins, wherein by making intervals between the central lead pin receiving a high voltage and other lead pins adjacent thereto greater than intervals between said other lead pins, desirable separation distances are provided.
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Accused Products
Abstract
In a conventional power circuit device, such as a power MOSFET monolithic integrated circuit device and a compound device, since five lead pins are lead out from the packaging with even intervals, sufficient separation distances between the third pin of a high voltage and other adjacent pins cannot be secured. According to this invention, the distances between the third pin and other adjacent pins are expanded so as to become wider than the distances between other pins. Furthermore, the third pin is formed into an upper position, its adjacent pins are formed into a lower position, and other pins are formed into a middle position. Thereby, sufficient separation distances between the third pin of the high voltage and other adjacent pins can be secured. Therefore, a structure favorable in terms of safety can be provided. Furthermore, by providing a full-mold packaging, the header portion is not exposed to assure an easy handling.
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Citations
11 Claims
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1. A power-supply circuit device comprising:
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a MOSFET;
a packaging sealing the MOSFET therein; and
a plurality of lead pins led out from a side wall of a main body of the packaging, a drain terminal of the MOSFET being connected to a central lead pin of the plurality of lead pins, wherein by making intervals between the central lead pin receiving a high voltage and other lead pins adjacent thereto greater than intervals between said other lead pins, desirable separation distances are provided. - View Dependent Claims (2, 3)
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4. A power-supply circuit device comprising:
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a MOSFET;
a packaging sealing the MOSFET therein; and
a plurality of lead pins led out from a side wall of a main body of the packaging, a drain terminal of the MOSFET being connected to a central lead pin of the plurality of lead pins, wherein by making intervals between the central lead pin receiving a high voltage and other lead pins adjacent thereto greater than intervals between said other lead pins, and by bending the lead pins receiving the lowest voltage of the plurality of lead pins to a lower position, bending the central lead pin to an upper position, and bending the other lead pins to a middle position between the upper and lower positions, desirable separation distances are provided between the central lead pin of the high voltage and the lead pins of the low voltage. - View Dependent Claims (5, 6)
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7. A power-supply circuit device comprising:
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a MOSFET;
a packaging sealing the MOSFET therein; and
five lead pins led out from a side wall of a main body of the packaging, a drain terminal of the MOSFET being connected to a third lead pin located at the center, wherein by making intervals between the third lead pin receiving a high voltage and other lead pins adjacent thereto greater than intervals between said other lead pins, desirable separation distances are provided between the third lead pin and adjacent second and fourth lead pins receiving a low voltage. - View Dependent Claims (8, 9, 10, 11)
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Specification