HIGH EFFICIENCY HEAT DISSIPATED POWER SUPPLY

• US 20040027803A1
• Filed: 12/05/2002
• Published: 02/12/2004
• Est. Priority Date: 08/07/2002
• Status: Active Grant

• Current Assignee: Chung Yen Tsai
• Original Assignee: Chung Yen Tsai
• Inventors: Tsai, Chung Yen
• Granted Patent: US 6,735,078 B2
• Time in Patent Office: Days
• US Class Current: 361/695
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 1/26 Power supply means, e.g. regulation thereof for memories G11C

Abstract

A high efficiency heat dissipated power supply comprises a base and a cover. The base receives power from a plug at a rear side thereof. The voltage of power is reduced, and is rectified by an electronic circuit for being used by a computer mainframe. A bank of fans are installed at a rear side of the base so that the fan absorbs air between the cover and base; and then guide the air to blow out the air. An interior of the cover has at least one cover fan. The cover fans are actuated by a power source. Then the air is exhausted by an exhausting fan at a rear side of the base. Thereby, air flows along three paths so that convection air is formed at the interior and exterior of the power supply; as a result heat dissipating efficiency is increased so that capacity and output power are increased.

Claims

1. A high efficiency heat dissipated power supply comprising a base and a cover;

the base receiving power from a plug at a rear side thereof;

the voltage of the power is reduced and rectified by an electronic circuit on the base for being used by a computer mainframe;

a bank of fans are installed at a rear side of the base so that the fan absorbs air between the cover and base; and

then guide the air to blow out;

characterized in that;

an interior of the cover has at least one cover fan;

the cover fans are actuated by a power source;

outer air is absorbed by the cover fan and then flows into the cover to blow the air to the electronic circuit;

then the air is exhausted by an exhausting fan at a rear side of the base;

thereby, air flows so that convection air is formed at the interior and exterior of the power supply;

as a result, heat dissipating efficiency is increased so that capacity and output power are increased.

2. The high efficiency heat dissipated power supply as claim in claim 1, wherein the plug is connected to a receptacle at a rear side of the base through an electronic switch;

when the power supply supplies power to a computer mainframe and the computer mainframe is actuated, the receptacle transfers power to a connected peripheral or another receptacle through an extension line; and

when the mainframe is closed, the electronic switch is operated so that the receptacle is turned off and thus the power does not flow through the receptacle;

thereby, no power is transferred;

thus, the power supply has the function of transferring power and by turning on or off the computer mainframe, output of power can be switched automatically.

3. The high efficiency heat dissipated power supply as claim in claim 2, wherein the peripheral is one of a screen and a printer.

4. The high efficiency heat dissipated power supply as claim in claim 1, wherein a front end of the base is installed with a front fan;

and the front fan, the exhausting fan and the cover fan in the cover are formed as a fan group.

5. The high efficiency heat dissipated power supply as claim in claim 1, wherein the front fan is a suction fan.