Waferless metrology recipe generator and generating method

• US 20040030430A1
• Filed: 06/26/2003
• Published: 02/12/2004
• Est. Priority Date: 06/27/2002
• Status: Abandoned Application

• Current Assignee: Ryoichi Matsuoka
• Original Assignee: Ryoichi Matsuoka
• Inventors: Matsuoka, Ryoichi
• Application Number:
  US10/607,295
• Publication Number:
  US 20040030430A1
• Time in Patent Office: Days
• US Class Current: 700/108
• CPC Class Codes: G05B 19/41865 characterised by job scheduling, process planning, material flow
• CPC Class Codes: G05B 2219/37441 Use nc machining program, cad data for measuring, inspection
• CPC Class Codes: G05B 2219/45031 Manufacturing semiconductor wafers
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

Abstract

A metrology recipe generator is offered which is capable of automatically creating a metrology recipe without halting the operation of the production line. The metrology recipe is used to carry out SEM-based dimensional metrology for evaluating patterns transferred onto wafers according to CAD data. The generator has a CAD alignment-specifying portion for specifying alignment in CAD according to CAD data and a CAD metrology position-specifying portion for specifying both the coordinates of positions on the wafers on which metrology measurements are made and a metrology type. The metrology recipe is created according to data from the CAD alignment-specifying portion and from the CAD metrology position-specifying portion.

Claims

1. A waferless metrology recipe generator for creating a metrology recipe used to implement SEM-based dimensional metrology that evaluates a pattern transferred onto a wafer according to CAD data, the recipe generator comprising:

alignment-specifying means for specifying alignment in CAD based on the CAD data;

coordinate-specifying means for specifying coordinates of positions on the wafer where metrology should be performed;

metrology type-specifying means for specifying a metrology type for each specified coordinate; and

recipe creation means for creating the metrology recipe in response, to the alignment specifying means, coordinate specifying means, and metrology type-specifying means.

2. A waferless metrology recipe generating method for creating a metrology recipe used to implement SEM-based dimensional metrology that evaluates a pattern transferred onto a wafer according to CAD data, the recipe generating method comprising the steps of:

specifying alignment in CAD based on the CAD data;

specifying coordinates of positions on the wafer where metrology should be performed;

specifying a metrology type for each specified coordinate; and

creating the metrology recipe in response to the specified alignment, specified coordinate, and specified metrology type.