Energy conditioning circuit assembly

• US 20040032304A1
• Filed: 05/23/2003
• Published: 02/19/2004
• Est. Priority Date: 04/07/1998
• Status: Active Grant

• Current Assignee: X2Y Attenuators, LLC
• Original Assignee: X2Y Attenuators, LLC
• Inventors: Anthony, Anthony A., Anthony, William M.
• Granted Patent: US 7,042,303 B2
• Time in Patent Office: Days
• US Class Current: 333/12
• CPC Class Codes: H01G 2/065 for surface mounting, e.g. chip capacitors
• CPC Class Codes: H01G 4/232 electrically connecting two or more layers of a stacked or rolled capacitor
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01R 13/719 specially adapted for high frequency, e.g. with filters
• CPC Class Codes: H03H 1/0007 of radio frequency interference filters
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 1/18 Printed circuits structurally associated with non-printed electric components H05K1/0201, H05K1/023, H05K1/0243, and H05K1/16 take precedence
• CPC Class Codes: H05K 1/181 associated with surface mounted components
• CPC Class Codes: H05K 3/3436 having an array of bottom contacts, e.g. pad grid array or ball grid array components

Abstract

The present invention is a component carrier (132) consisting of a plate of insulating material having a plurality of apertures (140) for accepting the leads of a thru-hole differential and common mode filter (130). Another embodiment consists of a surface mount component carrier (10) comprising a disk (16) of insulating material having a plurality of apertures (24). The same concept for the above described carrier is also incorporated into several alternate embodiments, either independently, embedded within electronic connectors. The overall configuration and electrical characteristics of the concepts underlying the present inventions are also described as an energy conditioning circuit assembly which encompasses the combination of differential and common mode filters and component carriers optimized for such filters. The various embodiments of component carriers provide increased physical support and protection to differential and common mode filters and substantially improve the electrical characteristics of the filters due to the increased shielding provided by the carriers. Embodiments of the carrier energy conditioning assembly include integrated circuit construction for a differential and common mode filter coupled to the power bus of an integrated circuit.

Claims

1. An energy conditioning arrangement comprising:

a circuit having at least a source of energy and an energy-utilizing load;

a substrate including;

a first pathway operable as an energy source path from the source of energy of the circuit to the energy-utilizing load of the circuit;

a second pathway operable as an energy return path from the energy-utilizing load of the circuit to the source of energy of the circuit;

a conductive area isolated from the first and the second pathway; and

an electrode arrangement having at least a first, a second, a third, a fourth, a fifth and a sixth electrode band;

wherein the first and the third electrode band are conductively isolated from the second and the fourth electrode band;

wherein the first, the third, the second, and the fourth electrode band are conductively isolated from the fifth and the sixth electrode band; and

wherein the first pathway is conductively coupled to the first and the third electrode band, the second pathway is conductively coupled to the second and the fourth electrode band, and the conductive area is conductively coupled to the fifth and the sixth electrode band; and

wherein the first and the second pathway are isolated from one another.

2. The energy conditioning arrangement as in claim 1, in which the electrode arrangement further comprises;

a plurality of shielding electrodes including at least a first, a second, and a third shielding electrode that are conductively coupled to one another;

a first electrode and a second electrode;

the plurality of shielding electrodes, the first electrode, and the second electrode are spaced apart from one another by a material;

the first and the second electrode are interspersed within the plurality of shielding electrodes;

wherein the first electrode is positioned between the first shielding electrode and the second shielding electrode; and

wherein the second electrode is positioned between the second shielding electrode and the third shielding electrode; and

wherein the first electrode is coupled to the first and the third electrode band, and wherein the second electrode is coupled to the second and the fourth electrode band, and wherein the plurality of shielding electrodes are coupled to the fifth and the sixth electrode band.

3. The energy conditioning arrangement as in claim 1, in which the electrode arrangement further comprises;

a plurality of shielding electrodes including at least a first, a second, and a third shielding electrode that are conductively coupled to one another;

a first electrode and a second electrode;

the plurality of shielding electrodes, the first electrode, and the second electrode are spaced apart from one another by a material;

the first and the second electrode are interspersed within the plurality of shielding electrodes;

wherein the first electrode is positioned between the first shielding electrode and the second shielding electrode; and

a seventh and an eighth electrode band;

wherein the first, the third, the second, and the fourth electrode band are conductively isolated from the seventh and the eighth electrode band and the conductive area is coupled to the seventh and the eighth electrode band; and

wherein the first electrode is coupled to the first and the third electrode band, and wherein the second electrode is coupled to the second and the fourth electrode band, and wherein the plurality of shielding electrodes are coupled to the fifth, the sixth, the seventh, and the eighth electrode band.

4. The energy conditioning arrangement as in claim 1, wherein the electrode arrangement further comprises;

a plurality of shielding electrodes of substantially the same size and shape including at least a first, a second, and a third shielding electrode;

wherein the plurality of shielding electrodes are conductively coupled;

a first and a second electrode of substantially the same size and shape;

the plurality of shielding electrodes and the first and the second electrode are spaced apart from one another by a material;

the first and the second electrode are interspersed within the plurality of shielding electrodes;

wherein the first electrode is positioned between the first and the second shielding electrode;

wherein the second electrode is positioned between the second and the third shielding electrode; and

a seventh and an eighth electrode band, wherein the first, the third, the second, and the fourth electrode band are conductively isolated from the seventh and the eighth electrode band and the conductive area is coupled to the seventh and the eighth electrode band; and

wherein the first electrode is coupled to the first and the third electrode band, and wherein the second electrode is coupled to the second and the fourth electrode band, and wherein the plurality of shielding electrodes are coupled to the fifth, the sixth, the seventh, and the eighth electrode band.

5. The energy conditioning arrangement of claim 1, wherein the substrate comprises a plurality of layers;

wherein the first and the second pathway are coupled thereon a first layer of the plurality of layers of the substrate; and

wherein the conductive area is coupled thereon a second layer of the plurality of layers of the substrate.

6. The energy conditioning arrangement of claim 1, wherein the substrate comprises a plurality of layers;

the first pathway is coupled thereon a first layer of the plurality of layers of the substrate ;

the second pathway is coupled thereon a second layer of the plurality of layers of the substrate; and

wherein the conductive area is coupled thereon a third layer of the plurality of layers of the substrate.

7. The energy conditioning arrangement as in claim 1, in which the circuit is energized.

8. The energy conditioning arrangement as in claim 1, in which the substrate is a printed circuit board.

9. The energy conditioning arrangement as in claim 1, in which the substrate is a connector.

10. The energy conditioning arrangement as in claim 1, in which the substrate is part of an integrated circuit package.

11. The energy conditioning arrangement as in claim 1, in which the first pathway is contiguous from the energy source to the third electrode band;

and wherein the first pathway is contiguous from the first electrode band to the energy-utilizing load; and

wherein the first pathway would be non-operable as a contiguous energy pathway from the energy source to the energy-utilizing load without selective coupling of portions of the electrode arrangement to the first pathway.

12. The energy conditioning arrangement as in claim 1, in which the first pathway is non-contiguous from the energy source to the energy-utilizing load without selective coupling of portions of the electrode arrangement to the first pathway;

and wherein the second pathway is non-contiguous from the energy-utilizing load to the energy source without selective coupling of portions of the electrode arrangement to the second pathway.

13. The energy conditioning arrangement as in claim 2, wherein the material is comprised of any one or more materials selected from a group of materials consisting of a ferrite material, a dielectric material or a varistor material.

14. The energy conditioning arrangement as in claim 1, wherein the first electrode band is positioned directly opposite the third electrode band with respect to the electrode arrangement;

and wherein the second electrode band is positioned directly opposite the fourth electrode band with respect to the electrode arrangement.

15. The energy conditioning arrangement as in claim 1, wherein the first electrode band is positioned diagonally to the third electrode band with respect to the electrode arrangement;

and wherein the second electrode band is positioned diagonally to the fourth electrode band with respect to the electrode arrangement.

16. The energy conditioning arrangement as in claim 1, in which the electrode arrangement is arranged within the plurality of layers of the substrate.

17. An circuit arrangement comprising:

a source of energy and an energy-utilizing load;

a first pathway operable as an energy source path from the source of energy of the circuit to the energy-utilizing load of the circuit;

a second pathway operable as an energy return path from the energy-utilizing load of the circuit to the source of energy of the circuit;

a conductive area that is conductively isolated from the first and the second pathway; and

an electrode arrangement including;

a plurality of shielding electrodes having at least a first, a second, and a third shielding electrode that are conductively coupled to one another;

a first electrode and a second electrode;

the plurality of shielding electrodes, the first electrode, and the second electrode are spaced apart from one another by a material;

the first and the second electrode are interspersed within the plurality of shielding electrodes; and

wherein the first electrode is positioned between the first and the second shielding electrode, and the second electrode is positioned between the second and the third shielding electrode; and

wherein the first electrode is coupled to the first pathway in at least a pair of opposing locations, and wherein the second electrode is coupled to the second pathway in at least a pair of opposing locations, and the plurality of shielding electrodes are coupled to the conductive area in at least a pair of opposing locations.

18. The circuit arrangement of claim 17, in which the circuit arrangement is coupled to an integrated circuit.

19. The circuit arrangement as in claim 17, wherein the material is comprised of any one or more materials selected from a group of materials consisting of a ferrite material, a dielectric material or a varistor material.

20. The circuit arrangement as in claim 17, in which the circuit arrangement is energized.