Circuit package integrating passive radio frequency structure
First Claim
1. A circuit package comprising:
- at least one integrated circuit device; and
a passive balun, the integrated circuit device being coupled to the passive balun.
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Accused Products
Abstract
In general, the invention is directed to integration of passive radio frequency (RF) structures with at least one integrated circuit in a single integrated circuit (IC) package. An IC package in accordance with the invention may include, for example, a radio IC, a digital IC, a passive radio frequency balun as well as additional passive RF structures or ICs. Additionally, passive electronic components may further be incorporated in the IC package. For example, the IC package may include a resistor, capacitor, inductor or the like. The components of the IC package may be distributed throughout layers of a multi-layer IC package, such as a multi-layer ceramic package. The different ICs and the passive RF structures may be electrically coupled via conductive traces, which may be varied in thickness and length in order to match input and output impedances of the different ICs and passive RF structures.
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Citations
41 Claims
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1. A circuit package comprising:
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at least one integrated circuit device; and
a passive balun, the integrated circuit device being coupled to the passive balun. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. An integrated circuit package comprising:
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a radio integrated circuit that converts radio frequency signals to baseband signals;
a digital integrated circuit that processes the inbound and outbound baseband frequency signals; and
a passive structure coupled to the radio integrated circuit. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41)
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Specification